Reflecting resin sheet, light emitting diode device and producing method thereof

a technology of reflecting resin and light-emitting diodes, which is applied in the direction of discharge tubes/lamp details, discharge tubes luminescnet screens, transportation and packaging, etc., can solve the problem and achieve the effect of reducing the light extraction efficiency

Inactive Publication Date: 2012-10-18
NITTO DENKO CORP
View PDF12 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011]However, in the white light emitting device obtained by the producing method in Japanese Unexamined Patent Publication No. 2005-191420, there is a disadvantage that the semiconductor light emitting element is spaced apart from the reflecting frame portion, so that a part of the light emitted from the semiconductor light emitting element toward the side is absorbed in the encapsulating portion before being reflected at the reflecting frame portion and as a result, extraction efficiency of the light is reduced.

Problems solved by technology

However, in the white light emitting device obtained by the producing method in Japanese Unexamined Patent Publication No. 2005-191420, there is a disadvantage that the semiconductor light emitting element is spaced apart from the reflecting frame portion, so that a part of the light emitted from the semiconductor light emitting element toward the side is absorbed in the encapsulating portion before being reflected at the reflecting frame portion and as a result, extraction efficiency of the light is reduced.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reflecting resin sheet, light emitting diode device and producing method thereof
  • Reflecting resin sheet, light emitting diode device and producing method thereof
  • Reflecting resin sheet, light emitting diode device and producing method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

The Embodiments in FIGS. 2 and 3

[0192]First, a reflecting resin sheet was prepared (ref: FIG. 2(b)).

[0193]That is, a first release substrate made of polyethylene terephthalate having a thickness of 25 μm was first prepared. Then, 100 parts by mass of thermosetting silicone resin and 20 parts by mass of a particle of titanium oxide (TiO2: tetragonal system of rutile) in a sphere shape having an average particle size of 300 nm were uniformly mixed, so that a reflecting resin composition was prepared. The prepared reflecting resin composition was applied on the entire upper surface of the first release substrate to form a reflecting film. Thereafter, by heating the reflecting film, a reflecting resin layer in a B-stage state having a thickness of 100 μm was formed over the entire upper surface of the first release substrate to form a laminated sheet including the first release substrate and the reflecting resin layer (ref: FIG. 2(a)).

[0194]Then, through holes in rectangular shapes in p...

example 2

The Embodiments in FIGS. 4 and 5

[0206]In the same manner as in Example 1, a laminated sheet was formed to form through holes and subsequently, a reflecting resin sheet was prepared (ref: FIGS. 4(a) and 4(b)).

[0207]Then, the reflecting resin sheet was turned over upside down. Thereafter, the turned over reflecting resin sheet was laminated on the upper surface of a second release substrate formed of a thermal release sheet (trade name of REVALPHA, manufactured by NITTO DENKO CORPORATION) having a thickness of 100 μm (ref: the lower portion in FIG. 4(c)).

[0208]In the same manner as in Example 1, light emitting diode elements were laminated on the upper surfaces of phosphor layers prepared according to the following description and the light emitting diode elements and the phosphor layers were turned over upside down (ref: the upper portion in FIG. 4(c)).

[0209]4 g of phosphor particles composed of Y3Al5O12:Ce (in a sphere shape, the average particle size of 95 nm); 0.21 g of poly(vinyl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element and includes a first release substrate and the reflecting resin layer provided on one surface in a thickness direction of the first release substrate. In the first release substrate and the reflecting resin layer, a through hole extending therethrough in the thickness direction is formed corresponding to the light emitting diode element so as to allow an inner circumference surface of the through hole in the reflecting resin layer to be disposed in opposed relation to a side surface of the light emitting diode element.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority from Japanese Patent Application No. 2011-089939 filed on Apr. 14, 2011, the contents of which are hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a reflecting resin sheet, a light emitting diode device, and a producing method thereof, to be specific, to a producing method of a light emitting diode device, a reflecting resin sheet used in the producing method, and a light emitting diode device obtained by the producing method of the light emitting diode device.[0004]2. Description of Related Art[0005]In recent years, as a light emitting device that is capable of emitting high-energy light, a white light emitting device has been known. In the white light emitting device, for example, a diode board; an LED (light emitting diode) laminated thereon, emitting blue light; a phosphor layer that can conver...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(United States)
IPC IPC(8): H01J1/62B32B3/24B29C65/76H01J5/16
CPCH01L33/505H01L33/56H01L2933/005H01L33/60H01L24/97Y10T156/11H01L2924/12041H01L2224/16225Y10T428/24322H01L2924/00H01L2924/12042H01L2924/15787H01L33/48H01L33/52
Inventor OOYABU, YASUNARIITO, HISATAKANAITO, TOSHIKI
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap