Heat transfer bridge

Abstract

A heat transfer bridge for absorbing heat from electronic circuits and electrical distribution transformers to thereby cool said components is disclosed. The heat transfer bridge includes a passive pump for pumping a fluid having a low boiling point that readily creates bubbles when heated to its boiling point. The bubbles are directed via selected flow paths to effectively push or drive the fluid from adjacent a heat source such as an electronic circuit or transformer to heat dissipating components such as cooling fins. In one embodiment, the fluid in the inventive heat transfer bridge comprises a fluid comprising metallic slurry that provides many times the heat dissipation rate as compared to a clear fluid.

Description

BACKGROUND OF THE INVENTION[0001]This utility application claims the benefit of the earlier filing date of the provisional application of the same title, “Heat Transfer Bridge”, Ser. No. 61 / 575,946 having a filing date of Aug. 31, 2011 and of the same inventor, Troy W. Livingston.[0002]The present invention relates to system for removing heat from heat generating components, and more particularly to a method and system for removing heat from electronic circuit boards, electronic chips and transformers.[0003]As is well known in the electrical industry, circuit boards and electronic chips and transformers create unwanted heat during operation. Heat build-up may cause a circuit board or transformer to malfunction or burn up and cause the entire system to also malfunction or to short out. The problem has become even more acute due to the fact that circuit boards have become smaller and / or more highly populated with components thus causing the source of heat to become more intense. Accor...

AI Technical Summary

Benefits of technology

The present invention provides a system and method for efficiently cooling electronic components, such as circuit boards and IC chips, which will allow for the design of smaller and lighter electronic systems. Additionally, the invention provides a way to cool power line transformers without replacing them, increasing their output and improving their performance. The invention uses a passive transfer pump to rapidly remove thermal energy from heat sources to heat sink areas using a liquid carrying a metallic slurry, which has been found to be multiple times more effective in transferring and conveying heat than fluorocarbon fluids. The invention also includes a heat transfer bridge that can be retrofitted onto existing transformers or included in the design of new transformers, ensuring continued safe and reliable operation.

Problems solved by technology

Continuous transformer operation at elevated temperatures therefore results in faster aging of the insulating material with a consequent reduction of the insulating properties of the material.

Reduction or loss of the insulating properties of the material results in the failure of the transformer.

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