Polyimide film

a polyimide film and film technology, applied in the field of polyimide film, can solve the problems of difficult film support only through fixtures or pins, high production equipment of bi-axial stretch technique, and inconvenient maintenance, and achieve excellent young's modulus and good dimensional stability
US20130280512A1Inactive Publication Date: 2013-10-24MORTECH CORP
3 Cites 1 Cited by

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
MORTECH CORP
Publication Date
2013-10-24
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

Disclosed herein is a polyimide film having inorganic particles. The polyimide film is 12-250 μm in thickness. The polyimide film includes about 50-90 weight parts of polyimide and about 10-50 weight parts of the inorganic particles. The particle size of each of the inorganic particles is about 0.1 μm to about 5 μm. The polyimide film is characterized in that the thermal expansion coefficient is equal to or less than 30 ppm / ° C. in any direction, the difference between two thermal expansion coefficients in two mutually perpendicular directions on the film surface is less than 10 ppm / ° C., and the Young's modulus of the polyimide film is greater than 4 GPa in any direction. The dimensional stability of the polyimide film measured by the standard of IPC-TM-650 is less than 0.10% in any direction. A method for manufacturing the polyimide film is disclosed as well.
Need to check novelty before this filing date? Find Prior Art

Description

RELATED APPLICATION

[0001] The present application is a divisional of U.S. application Ser. No. 13 / 618,670, filed on Sep. 14, 2012, which claims priority to Taiwan Application Serial Number 100133039, filed Sep. 14, 2011. The entire disclosures of the above applications are hereby incorporated by reference herein.BACKGROUND

[0002] 1. Technical Field

[0003] The present disclosure relates to a polyimide film and a method for manufacturing the same. More particularly, the present disclosure relates to a polyimide film having inorganic particles and a method for manufacturing the same.

[0004] 2. Description of Related Art

[0005] The polyimide polymer is widely applied due to the excellent mechanical strength, insulating property and high temperature resistance thereof, such as a flexible printed circuit (FPC) applied in various electronic products. A general FPC is formed by etching a flexible copper clad laminate (FCCL) into conducting lines connecting with various circuit components and then co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More