Method for making an electrical circuit

Abstract

A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is related to the following U.S. patent applications, filed on even date herewith by the present inventors: Docket No. MAT-20A, entitled “Flexible circuit board and connection system”; Docket No. MAT-20B, entitled “Rigid circuit board with flexibly attached module”; Docket No. MAT-20D entitled “Electronic module with heat spreading enclosure”; Docket No. MAT-20E entitled “Electronic interconnect system”; Docket No. MAT-20F entitled “Pierced flexible circuit and compression joint”; and Docket No. MAT-20G entitled “Compression connector system.” The entire disclosures of each of the foregoing are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates generally to means for connecting microelectronic devices and systems. More particularly, the invention relates to improved flex-circuit based interconnect solutions for electronic circuits.[0004]2. Descrip...

AI Technical Summary

Benefits of technology

[0008]Objects of the present invention include at least the following: providing a flex circuit board and interconnect system having reduced size and complexity; providing a low-cost, highly reliable flex circuit board or module and associated interconnect system; providing a more reliable and manufacturable flex circuit board or module suitable for directly mounting on a motherboard without additional packaging; providing a motherboard with flex circuit boards mounted thereon via a compliant interconnect; and, providing a method for manufacturing flex circuits that is cost effective and suitable for mounting directly on a motherboard without a separate socket.

[0009]In accordance with one aspect of the invention, a flexible circuit board comprises: a multilayer flex circuit having bifurcated extensions along one edge thereof and a plurality of electronic components mounted on at least one surface thereof; and a plurality of electrode pads positioned on the inner and/or outer surfaces of the two legs of the bifurcated extensions such that when the legs are spread apart by about 180° the electrode pads are alignable with respective contacts on a motherboard, and/or on a clamping connector and connectable thereto, so that a secure, mechanically flexible connection may be created between the flexible ci

Problems solved by technology

As the number of lines increases, and the pitch becomes corresponding

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