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Method for making an electrical circuit

a technology of electrical circuits and methods, applied in the direction of printing element electric connection formation, manufacturing tools, solventing apparatus, etc., can solve the problems of cost and reliability of this approach, and achieve the effects of reducing size and complexity, high reliability, and cost saving

Inactive Publication Date: 2014-04-17
MICROELECTRONICS ASSEMBLY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes various aspects of a flexible circuit board that can be connected to a rigid circuit board or motherboard, creating a secure and flexible electrical connection. The flexible circuit board has bifurcated extensions along one edge and electrode pads that align with contacts on the motherboard or clamping connector. This allows for easy and secure connection between the flexible circuit board and the motherboard. The invention also provides a method for making an electrical circuit by aligning flexible circuit board electrode pads with the contacts on the rigid circuit board and forming an electrical connection. Additionally, the patent describes an electronic subsystem where a flexible circuit board is connected to a rigid circuit board and extending at an angle along the edge of the motherboard. The flexible circuit board has electrode pads that align with contacts on the motherboard, creating a secure and flexible connection. The technical effects of this patent are the creation of a flexible and secure electrical connection between a rigid circuit board and a motherboard or clamping connector, making it easier to create complex and flexible electronic systems.

Problems solved by technology

As the number of lines increases, and the pitch becomes correspondingly smaller, both the cost and reliability of this approach can suffer.

Method used

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  • Method for making an electrical circuit
  • Method for making an electrical circuit
  • Method for making an electrical circuit

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[0083]The inventive circuit is preferably manufactured as follows. First, two individual flexible circuit plies or laminates having conductive traces (typically on both surfaces) and vias connecting one surface to the other and one ply to another as needed, are formed by conventional means and bonded together over most of their surface area to form a multilayer flex panel or circuit board, leaving an unbonded strip (bifurcation) along one edge. The electrode pads intended to connect this circuit to a motherboard are located on the inner surfaces of the bifurcation. Next, the flex circuit is populated by microelectronic devices, which may be any combination of analog, digital, or mixed-mode semiconductor devices or passive components. This step will typically involve conventional “pick and place” assembly using solder or conductive adhesives as are known in the art. Then, the two legs of the bifurcated extensions or area are spread apart and the electrode pads are aligned with rows o...

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Abstract

A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is related to the following U.S. patent applications, filed on even date herewith by the present inventors: Docket No. MAT-20A, entitled “Flexible circuit board and connection system”; Docket No. MAT-20B, entitled “Rigid circuit board with flexibly attached module”; Docket No. MAT-20D entitled “Electronic module with heat spreading enclosure”; Docket No. MAT-20E entitled “Electronic interconnect system”; Docket No. MAT-20F entitled “Pierced flexible circuit and compression joint”; and Docket No. MAT-20G entitled “Compression connector system.” The entire disclosures of each of the foregoing are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates generally to means for connecting microelectronic devices and systems. More particularly, the invention relates to improved flex-circuit based interconnect solutions for electronic circuits.[0004]2. Descrip...

Claims

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Application Information

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IPC IPC(8): H05K3/36B23K1/20B29C65/48
CPCH05K3/363B23K1/0016B23K2101/42H05K1/141H05K3/32H05K3/366H05K3/40H05K2201/046H05K2201/048H05K2201/052Y10T29/49126Y10T156/1002
Inventor CLAYTON, JAMES E.FATHI, ZAKARYAE
Owner MICROELECTRONICS ASSEMBLY TECH
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