Semiconductor packages

Inactive Publication Date: 2014-05-08
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0083]According to example embodiments, a semiconductor package may include an EMI shield member covering a semiconductor chip and having a graphite layer. Ground connection pads may be arranged around the semiconductor chip on an upper surface of a mounting substrate. Condu

Problems solved by technology

Electromagnetic waves emitted from a semiconductor package may generate noise and interference with devices within range of the emissions and may cause those devices to malfunction or otherwise create errors.
However, conven

Method used

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  • Semiconductor packages
  • Semiconductor packages
  • Semiconductor packages

Examples

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Embodiment Construction

[0108]Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. Exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough, and will convey the scope of exemplary embodiments to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.

[0109]It will be understood that when an element or layer is referred to as being “on,”“connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,”“directly connected to” or “directly coupled to” another element or layer,...

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PUM

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Abstract

A semiconductor package includes a mounting substrate having a chip-mounting region and a peripheral region, a first semiconductor chip mounted on the chip-mounting region of the mounting substrate, a first molding member on the mounting substrate to cover at least a portion of the first semiconductor chip, a plurality of first conductive connection members penetrating at least a portion of the first molding member, the first conductive connection members electrically connected to a plurality of ground connection pads provided on the peripheral region of the mounting substrate, respectively, and an electromagnetic interference (EMI) shield member covering the first semiconductor chip and including a graphite layer electrically connected to the first conductive connection members.

Description

PRIORITY STATEMENT[0001]This application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2012-0124398, filed on Nov. 5, 2012 in the Korean Intellectual Property Office (KIPO), the contents of which are herein incorporated by reference in their entirety.BACKGROUND[0002]1. Field[0003]Exemplary embodiments in accordance with principles of inventive concepts relate to a semiconductor package and a method of manufacturing a semiconductor package. More particularly, exemplary embodiments in accordance with principles of inventive concepts relate to a semiconductor package including a semiconductor chip and a method of manufacturing the semiconductor package.[0004]2. Description of the Related Art[0005]Electromagnetic waves emitted from a semiconductor package may generate noise and interference with devices within range of the emissions and may cause those devices to malfunction or otherwise create errors. Electromagnetic interference (EMI) shields may be installe...

Claims

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Application Information

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IPC IPC(8): H01L23/552
CPCH01L23/552H01L25/105H01L2224/13025H01L2224/131H01L2224/14181H01L2224/16145H01L2224/16225H01L2224/32145H01L2224/32225H01L2224/48227H01L2224/73204H01L2224/73253H01L2224/73265H01L2224/92125H01L2225/06517H01L2225/1023H01L2225/1058H01L2924/1431H01L2924/1434H01L2924/15311H01L2924/15331H01L2924/18161H01L2225/06513H01L2225/06541H01L2225/06565H01L2924/3025H01L24/73H01L2924/00012H01L2924/014H01L2924/00H05K9/00H01L23/60
Inventor PARK, SOO-JEOUNG
Owner SAMSUNG ELECTRONICS CO LTD
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