Saw-less receiver with RF frequency translated bpf

Abstract

A SAW-less receiver includes an interface, an RF to IF receiver section, and a receiver IF to baseband section. The RF to IF receiver section includes a frequency translated bandpass filter (FTBPF), a Low Noise Amplifier (LNA), and a mixing section. The FTBPF includes a switching network and a plurality of baseband impedances. The switching network is operable to couple the plurality of baseband impedances to the interface in accordance with a plurality of phase-offset RF clock signals to RF bandpass filter the inbound RF signal. The LNA amplifies the filtered inbound RF signal and the mixing section mixes the amplified inbound RF signal with a local oscillation to produce an inbound IF signal. The receiver IF to baseband section converts the inbound IF signal into one or more inbound symbol streams. Filtering may be prior or after amplification by the LNA.

Description

CROSS REFERENCE TO RELATED PATENTS[0001]The present U.S. Utility patent application claims priority pursuant to 35 U.S.C. §120 as a continuation of U.S. Utility application Ser. No. 13 / 076,183, entitled “SAW-Less Receiver with RF Frequency Translated BPF,” filed Mar. 30, 2011, pending, which is a continuation-in-part (CIP) of U.S. Utility application Ser. No. 13 / 070,980, entitled, “SAW-Less Receiver with RF Frequency Translated BPF,” filed Mar. 24, 2011, now U.S. Pat. No. 8,483,642, all of which are incorporated herein by reference in their entirety and made part of the present U.S. Utility patent application for all purposes.[0002]U.S. Utility patent application Ser. No. 13 / 076,183 claims priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61 / 351,284, entitled “Configurable and Scalable RF Front-end Module,” filed Jun. 3, 2010, now expired, which is incorporated herein by reference in its entirety and made part of the present U.S. Utility patent application for all...

AI Technical Summary

Benefits of technology

The present invention is about new tools and methods for use. The details of this invention can be found in the accompanying drawings and description. As a senior R&D personnel, you should be able to understand the technical effects of this invention from the information provided in the text.

Problems solved by technology

Redesigning the analog portions, however, is not a straightforward task since most analog circuitry (e.g., inductors, capacitors, etc.) does not “shrink” with the IC process.

Images