Method for the removal and recovery of metals and precious metals from substrates

Abstract

A method for removing metal and / or precious metal-containing depositions from substrates, wherein said substrate is subjected to treatment with an organo amine protectant component P and an inorganic active component A. Component P may be formed in situ by reaction with component R. Component P is an organic amine and / or organic amine hydrochloride (preferably diisopropylamine hydrochloride), component A is an inorganic compound (preferably inorganic acid or a mixture thereof) and component R is an organic compound that can be split along the C—N bond by the component A into an organic amine (preferably dimethylformamide or N-methyl pyrrolidone). The metals in the form of organo-metallic complexes can be isolated and / or separated by means of different chemical reactions (preferably reduction reactions) and / or biosorption (preferably with seaweed or yeast).

Description

FIELD OF THE INVENTION[0001]Traditionally it has been a challenge to remove thick and or multiple layers of depositions of metals and precious metals from various types of substrates. Current methods typically involve manually or mechanically removing depositions, including precious metal layers, which can damage substrates. Other methods can include the use of aggressive or poisonous chemicals to remove the precious metals that can also damage or destroy the substrate or that may not remove the entire deposition from the substrate. Therefore, it was desirable to develop a chemical method to remove layers of depositions, including precious metals, form various types of substrates.[0002]Traditionally, separating different precious metals and metals has been a challenging if not impossible task. This has led to the loss of precious metals due to the lack of a viable method to separate then once they have been chemically changed from a metal to a compound in solution. Therefore, it was...

AI Technical Summary

Benefits of technology

This method allows for the efficient and non-damaging removal of metals and precious metals from various substrates, including gold and platinum, with high purity and yield, while avoiding the use of harmful chemicals, and enables the recovery and recycling of substrates, particularly polymeric ones, through a chemical process that preserves the substrate integrity.

Problems solved by technology

Traditionally it has been a challenge to remove thick and or multiple layers of depositions of metals and precious metals from various types of substrates.

Current methods typically involve manually or mechanically removing depositions, including precious metal layers, which can damage substrates.

Traditionally, separating different precious metals and metals has been a challenging if not impossible task.

This has led to the loss of precious metals due to the lack of a viable method to separate then once they have been chemically changed from a metal to a compound in solution.

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