Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction
Inactive Publication Date: 2015-04-16
PAI HAO
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- Abstract
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Benefits of technology
The present invention provides a method for manufacturing an ultra thin slab-shaped capillary structure for thermal conduction. This structure includes a housing with multiple recessed portions that form a vapor channel for heat exchange. A thin slab with improved strength prevents the heat pipe from being depressed or reducing thermal contact resistance. As a result, the ultra thin heat pipe still achieves efficient thermal conduction.
Problems solved by technology
Since the ultra thin heat pipe requires a thin thickness, therefore a capillary structure in the heat pipe also requires a thin thickness, or else a vapor channel with sufficient space cannot be formed in the heat pipe.
However, a too-thin capillary structure cannot be filled into the gap between a mandrel and a heat pipe wall, since the gap is relatively smaller.
When a metal powder is filled, a relatively larger resistance is produced, so that the manufacture cannot be performed.
Therefore, the powder capillary structure can be formed only in some positions of the conventional ultra thin heat pipe and the structure is not thin, so that the powder capillary structure cannot be filled up easily in the cross-section of the conventional ultra thin heat pipe, and the capillary structure fails to provide good evaporating and condensing surfaces and sectional transmission surface while having a sufficient vapor channel, and the weak internal support structure may cause a depression of the heat pipe easily and result in a large thermal contact resistance, and thus failing to improve the thermal conduction efficiency.
Method used
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[0022]The technical contents of the present invention will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is noteworthy that the drawings are provided for the purpose of illustrating the present invention, but not intended for limiting the scope of the invention.
[0023]With reference to FIG. 1 for a flow chart of a method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction, the method comprises the following steps:
[0024]S1: (Refer to FIG. 2 as well as FIG. 1 for this step) Prepare a slab-shaped capillary structure 1, wherein the slab-shaped capillary structure 1 is one formed by a knitted fabric, a fiber, a metal powder sintering or any combination of the above, so as to form a thin slab-shaped member.
[0025]S2: (Refer to FIGS. 2 and 3 as well as FIG. 1): Form a plurality of narrow and long recessed portions 100 with an interval apart from one another on a surfac...
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Abstract
A method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction includes the steps of preparing a slab-shaped capillary structure, forming narrow and long recessed portions with an interval apart from each other on a surface of the slab-shaped capillary structure by an extrusion method, and arranging the recessed portion along the lengthwise direction of the slab-shaped capillary structure, and installing the slab-shaped capillary structure in a hollow plate-like housing, such that a vapor channel is formed between each recessed portion of the slab-shaped capillary structure and an inner wall of the plate-like housing.
Description
FIELD OF THE INVENTION[0001]The present invention relates to the manufacturing process of thin conductive components, and more particularly to a method of manufacturing ultra thin slab-shaped capillary structures such as vapor chambers and thin heat pipes for thermal conduction.BACKGROUND OF THE INVENTION[0002]Since most of the present 3C electronic products come with a light, thin, short and compact design, therefore a slim design of a heat pipe for the heat dissipation or thermal conduction inside the electronic products is required, and thus a ultra thin heat pipe (with a thickness below 1.5 mm) is introduced.[0003]Since the ultra thin heat pipe requires a thin thickness, therefore a capillary structure in the heat pipe also requires a thin thickness, or else a vapor channel with sufficient space cannot be formed in the heat pipe. However, a too-thin capillary structure cannot be filled into the gap between a mandrel and a heat pipe wall, since the gap is relatively smaller. When...
Claims
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Login to View More IPC IPC(8): F28D15/04
CPCF28D15/046F28D15/0233Y10T29/49353
InventorPAI, HAO
OwnerPAI HAO