Internal material condition monitoring for control
a technology of condition monitoring and internal material, applied in the direction of mechanical means, process and machine control, instruments, etc., can solve the problems of not being able to embed thermal sensors themselves, providing little information on the health of individual cells, hidden changes of materials on the surface, etc., to enhance the observationability of the bond
Inactive Publication Date: 2015-06-11
JENTEK SENSORS
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Benefits of technology
The patent describes a method of monitoring a process by using a sensor to measure a state at the interface between two materials, one of which is embedded in a matrix of another material. This method allows for better control decisions during the process. Several techniques can be used to enhance the observability of the bond between the embedded material and the matrix material with a sensor, such as adding a coating to the embedded material or measuring the temperature. Overall, this patent provides a way to monitor the state of a process and improve its efficiency.
Problems solved by technology
Furthermore, these processes are often performed in a batch mode according to a preset processing schedule, with only an occasional post-process inspection or destructive evaluation performed to ensure material quality.
Similarly, many material systems and devices have multiple material layer or embedded materials and applying a process or operation of these systems can lead to material changes hidden from the surface.
It is typically not possible to embed thermal sensors themselves due to limited space or accessibility, and the state of the devices using these materials is usually obtained from the variations in the electrical signals.
While this methodology is very successful at obtaining a real-time health report of the SOFC power system, it provides little information on the health of individual cells.
However, these techniques are destructive and slow, typically taking from seven to ten days to complete.
Existing magnetic / electromagnetic, diffraction, ultrasonic and other methods for assessment of residual stresses or monitoring of applied stress over wide areas are not yet practical or cost-effective.
However this requires intimate fixed contact between the strain gage and the MUT and individual connections to each of the strain gages, both of which limit the potential usefulness for monitoring stress over large areas.
Furthermore, strain gages are limited in durability and do not always provide sufficient warning of gage failure or malfunction.
However, attempts to use conventional inductive, i.e., eddy-current, sensors for assessment of residual stresses as well as for a number of other applications have shown significant limitations, particularly for complex geometry components.
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[0028]A description of preferred embodiments of the invention follows.
[0029]This invention is directed toward the nondestructive characterization of a material system for the purpose of controlling the functional operation or performing a process on a material. The material system can have multiple component materials, such as a multiple layer geometry, or it can have one material, such as a fiber or a fiber weave, embedded within a matrix of another material. Generally, the test material either has component materials that have different absolute electric, magnetic or thermal properties or can be modeled or represented with material regions or layers having different absolute properties. A sensor placed near the material system can then preferentially monitor the property changes in one of the materials or model layers while a process is performed on the material system. In this context, the process changes a kinematic, environmental, or physical state of the test material. This is...
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Abstract
The condition of internal or hidden material layers or interfaces is monitored and used for control of a process that changes a condition of a material system. The material system has multiple component materials, such as layers or embedded constituents, or can be represented with multiple layers to model spatial distributions in the material properties. The material condition changes as a result of a process performed on the material, such as by cold working, or from functional operation. Sensors placed proximate to the test material surface or embedded between material layers are used to monitor a material property using magnetic, electric, or thermal interrogation fields. The sensor responses are converted into states of the material condition, such as temperature or residual stress, typically with a precomputed database of sensor responses. The sensor responses can also be used to determine properties of the test material, such as electrical conductivity or magnetic permeability, prior to conversion to the material state. The states are used to support control decisions that control the process or operation causing the material condition to change.
Description
RELATED APPLICATION(S)[0001]This application is a Continuation Application of U.S. application Ser. No.11 / 079,912 filed Mar. 14, 2005 which claims the benefit of U.S. Provisional Application No. 60 / 553,473 filed Mar. 15, 2004 and 60 / 564,316 filed Apr. 22, 2004, the entire teachings of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]The technical field of this invention is that of nondestructive materials characterization as applied to control of a process that changes the material properties. The nondestructive characterization provides a quantitative, model-based assessment of surface, near-surface, and bulk material condition for flat and curved parts or components. Characterization of bulk material condition includes (1) measurement of changes in material state, such as degradation / damage caused by fatigue damage, creep damage, thermal exposure, or plastic deformation; (2) assessment of residual stresses and applied loads; and (3) assessment of process...
Claims
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IPC IPC(8): G01N27/02G01N27/60G01N27/72G01N25/00G01N19/00
CPCG01N27/02G01N25/00G01N27/60G01N27/72G01N19/00G05D23/26G05D23/1931G05D23/22G05D23/24
InventorGOLDFINE, NEIL J.ZILBERSTEIN, VLADIMIR A.SHAY, IAN C.CRAVEN, CHRISTOPHER A.GRUNDY, DAVID C.WEISS, VOLKERWASHABAUGH, ANDREW P.
OwnerJENTEK SENSORS