Apparatus and methods for micro-transfer-printing

Abstract

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

Description

PRIORITY APPLICATIONS[0001]This application claims priority to and the benefit of U.S. Provisional Patent Application No. 62 / 026,694, filed Jul. 20, 2014, entitled “Apparatus and Method for Micro-Transfer Printing” and U.S. Provisional Patent Application No. 62 / 027,166, filed Jul. 21, 2014, entitled “Methods and Tools for Micro-Transfer Printing,” the contents of each of which is incorporated by reference herein in its entirety.FIELD OF THE INVENTION[0002]The present invention relates to methods and tools for micro-transfer-printing printable devices to destination substrates.BACKGROUND OF THE INVENTION[0003]The disclosed technology relates generally to methods and tools for micro-transfer-printing. It is often difficult to pick up and place ultra-thin and / or small devices using this technology. Micro transfer printing permits the selection and application of these ultra-thin, fragile, and / or small devices without causing damage to the devices themselves.[0004]Micro-transfer-printin...

AI Technical Summary

Benefits of technology

This patent describes a new method for transfer printing semiconductor devices from one substrate to another. The method uses high acceleration to pick up the chips from the source wafer, which increases the adhesion between the stamp and the source. The printed devices can also be used on non-native substrates by using polymer encapsulations that contract and reflow when in contact with the destination substrate. The polymer layer can then be removed, leaving behind the transferred device. The method can also be used on topographic surfaces.

Problems solved by technology

It is often difficult to pick up and place ultra-thin and / or small devices using this technology.

However, compression of the transfer device poses several issues.

Among other things, there is a possibility of sagging between posts.

As the span between adjacent posts is increased, the risk of sag causing problems increases.

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