Multi-layer large-format imprinted structure

Abstract

A filled large-format imprinted structure includes a substrate and a first cured layer located over the substrate. One or more first micro-cavities are imprinted in the first cured layer, each first micro-cavity having a first micro-cavity width less than or equal to 20 microns. A second cured layer is located over the first layer and the one or more first micro-cavities. One or more second micro-cavities are imprinted in the second cured layer, each second micro-cavity having a second micro-cavity width less than or equal to 20 microns. A common first cured material is located in the first micro-cavity and in the second micro-cavity, thereby defining a filled large-format imprinted structure.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]Reference is made to commonly-assigned U.S. patent application Serial No. (Docket K001725) filed concurrently herewith, entitled Filled Large-Format Imprinted Structure by Cok; to commonly-assigned U.S. patent application Serial No. (Docket K001727) filed concurrently herewith, entitled Filled Large-Format Imprinting Method by Cok; to commonly-assigned U.S. patent application Serial No. (Docket K001728) filed concurrently herewith, entitled Ribbed Large-Format Imprinted Structure by Cok; to commonly-assigned U.S. patent application Serial No. (Docket K001729) filed concurrently herewith, entitled Ribbed Large-Format Imprinting Method by Cok; to commonly-assigned U.S. patent application Serial No. (Docket K001731) filed concurrently herewith, entitled Multi-Layer Large-Format Imprinting Method by Cok; to commonly-assigned U.S. patent application Serial No. (Docket K001732) filed concurrently herewith, entitled Stacked Large-Format Imprinte...

AI Technical Summary

Benefits of technology

The patent describes a need for better methods and materials to make large-format structures, like color filters, that are more uniform, bigger, and faster to manufacture. The present invention provides a way to make these structures by using a process that requires less material and equipment.

Problems solved by technology

This process is expensive and time consuming because it is a subtractive process that is wasteful of etched materials, uses additional, expensive materials such as photoresists and masks, and requires expensive optical alignment equipment.

However, as with the imprinting process itself, it is difficult to uniformly fill a large, imprinted area with a liquid that is subsequently cured.

For example, the coffee-ring effect is widely known to compromise the uniformity of a dried coating because of capillary flow induced by differential evaporation rates over the extent of the coating.

Therefore, because of such imprinting and drying problems, it is difficult to form large fill-factor substrates, such as color filter substrates, using imprint-and-fill processes.

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