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Semiconductor electroplating system

a technology of electroplating system and semiconductor, which is applied in the direction of contacting device, radio frequency control device, transportation and packaging, etc., can solve the problems of difficult to reduce the cost of inductors, design inconvenience, and large assembly time of rf sensors, so as to enhance design convenience and save assembly time of chip packages. cost

Inactive Publication Date: 2016-10-27
XINTEC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a chip package that has both active and passive component functions. By using a redistribution layer with a passive component portion, the chip package can serve as an inductor, which saves manufacturing time and eliminates the need for a separate inductor. This design also reduces assembly time, cost, and design limitations.

Problems solved by technology

However, it leads to a lot of assembly time for the RF sensor, and makes it difficult to reduce the cost of the inductors.
Moreover, additional space and circuits need to be reserved on the printed circuit board, thereby causing design inconvenience.

Method used

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  • Semiconductor electroplating system
  • Semiconductor electroplating system
  • Semiconductor electroplating system

Examples

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Embodiment Construction

[0042]Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0043]FIG. 1 is a cross-sectional view of a chip package 100 according to an embodiment of the present invention. FIG. 2 is a schematic view of a layout of a redistribution layer 130 of the chip package 100 shown in FIG. 1. As shown in FIG. 1 and FIG. 2, the chip package 100 includes a chip 110, an isolation layer 120, and a redistribution layer (RDL) 130. The chip 110 has a substrate 112, an electrical pad 114 and a protection layer 116. The substrate 112 has a first surface 111 and an opposite second surface 113. The protection layer 116 is located on the first surface 111. The electrical pad 114 is located in the protection layer 116. The substrate 112 has a through hole 115, and the protection layer 116 ha...

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Abstract

A semiconductor electroplating system includes a conducting ring and at least one conductive device. The conducting ring is used for carrying a wafer. The conducting ring has at least two connecting points. The wafer has a first surface and an opposite second surface. An isolation layer is located on the second surface. Two ends of the conductive device are respectively connected to the two connecting points of the conducting ring. When the conducting ring is immersed in the plating solution and is energized, a redistribution layer that is to be patterned is formed on the isolation layer. The conductive device is used for transmitting a partial current that passes through one of the connecting points to the other connecting point.

Description

RELATED APPLICATIONS[0001]This application claims priority to U.S. Provisional Application Ser. No. 62 / 153,400 filed Apr. 27, 2015, and Taiwan Application Serial Number 104126716, filed Aug. 17, 2015, the disclosures of which are incorporated herein by reference in their entireties.BACKGROUND[0002]1. Field of Invention[0003]The present invention relates to a semiconductor electroplating system.[0004]2. Description of Related Art[0005]A typical RF sensor includes a chip package and passive components. The passive components can be, for example, inductors. And the chip package is used as an active component. Both the chip package and the inductors are disposed on a printed circuit board, and the inductors are placed outside the chip package.[0006]That is to say, after the chip package is manufactured, additional and independent inductors are required to be arranged on the printed circuit board to allow the RF sensor working properly. However, it leads to a lot of assembly time for the...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/522H01L23/48H01L21/768H01L21/288C25D17/08H01L49/02H01L21/673H01L21/677C25D17/00C25D7/12H01L27/144H01L21/3205H10N97/00
CPCH01L23/5227H01L27/144H01L23/481H01L21/76898H01L21/2885H01L21/32051C25D17/001H01L21/67323H01L21/67751C25D17/007C25D7/12C25D17/08C25D17/005H01L28/10H01L23/525H01L23/53214H01L23/53228C25D17/06H01L2224/11H01L21/4846H01L21/4853H01L21/486H01L21/68721H01L23/498H01L23/49811H01L23/49827H01L23/49838
Inventor HO, YEN-SHIHCHANG, SHU-MINGSHEN, HSING-LUNGSU, YU-HAOWU, KUAN-JUNGCHENG, YI
Owner XINTEC INC
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