Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for producing printed circuit board, and resin composition

a printed circuit board and resin composition technology, applied in printed circuits, circuit susbtrate materials, electrical equipment, etc., can solve problems such as unfavorable warpage of semiconductor plastic packages, and achieve the effect of enhancing adhesion

Inactive Publication Date: 2018-06-14
MITSUBISHI GAS CHEM CO INC
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method for making a printed circuit board that improves the adhesion between the insulating layer and the conductor layer. This is done using a resin composition that contains an inorganic filler.

Problems solved by technology

Along with this, the difference in the coefficient of thermal expansion between a semiconductor device and a printed circuit board for semiconductor plastic packages causes the undesired warpage of semiconductor plastic packages.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

example 1

[Preparation of Prepreg]

[0107]10 parts by mass of the α-naphthol aralkyl-based cyanate ester resin obtained by Synthesis Example 1, 35 parts by mass of a novolac-based maleimide compound (BMI-2300, manufactured by Daiwa Fine Chemicals Co., Ltd.), 35 parts by mass of bisallylnadimide (BANI-M, manufactured by Maruzen Petrochemical Co., Ltd.), and 20 parts by mass of a biphenyl aralkyl-based epoxy resin (NC-3000FH, manufactured by Nippon Kayaku Co., Ltd.) were mixed with 100 parts by mass of spherical silica (SC-5050MOB, particle size: 1.6 μm, manufactured by Admatechs Co., Ltd.), 5 parts by mass of an acrylic silane compound 3-acryloxypropyltrimethoxysilane (KBM-5103, manufactured by Shin-Etsu Chemical Co., Ltd.), and 1 part by mass of a wetting dispersant (DISPERBYK-161, manufactured by BYK Japan K.K.), and the mixture was diluted with methyl ethyl ketone to obtain varnish. An E glass woven fabric was impregnated and coated with this varnish, and dried by heating at 160° C. for 3 min...

example 2

[0110]A metal foil-clad laminate as well as a printed circuit board were obtained in the same way as in Example 1 except that 2.5 parts by mass of an epoxysilane compound 3-glycidoxypropyltrimethoxysilane (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) and 2.5 parts by mass of an acrylic silane compound 3-acryloxypropyltrimethoxysilane (KBM-5103, manufactured by Shin-Etsu Chemical Co., Ltd.) were used instead of 5 parts by mass of an acrylic silane compound 3-acryloxypropyltrimethoxysilane (KBM-5103, manufactured by Shin-Etsu Chemical Co., Ltd.).

example 3

[0111]A metal foil-clad laminate as well as a printed circuit board were obtained in the same way as in Example 1 except that 5 parts by mass of an acrylic silane compound methacryloxyoctyltrimethoxysilane (KBM-5803, manufactured by Shin-Etsu Chemical Co., Ltd.) was used instead of 5 parts by mass of an acrylic silane compound 3-acryloxypropyltrimethoxysilane (KBM-5103, manufactured by Shin-Etsu Chemical Co., Ltd.).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thermosettingaaaaaaaaaa
hydrolyzableaaaaaaaaaa
insulatingaaaaaaaaaa
Login to View More

Abstract

It is intended to provide a method for producing a printed circuit board capable of enhancing the adhesion between the inorganic filler-containing insulating layer and the conductor layer of a printed circuit board. The method for producing a printed circuit board of the present invention is a method for producing a printed circuit board, having an alkali treatment step of bringing a surface of an insulating layer for a printed circuit board into contact with an aqueous alkali solution, and a conductor layer forming step of forming a conductor layer on at least a part of the surface of the insulating layer that has undergone the alkali treatment step, wherein the insulating layer contains a resin composition containing a thermosetting resin, a silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

Description

TECHNICAL FIELD[0001]The present invention relates to a method for producing a printed circuit board and to a resin composition.BACKGROUND ART[0002]The high integration or high-density packaging of each component for semiconductor packages has been increasingly accelerated in recent years as semiconductor packages widely used in electronics, communication devices, personal computers, etc. have been more highly functionalized or miniaturized. Along with this, the difference in the coefficient of thermal expansion between a semiconductor device and a printed circuit board for semiconductor plastic packages causes the undesired warpage of semiconductor plastic packages. Various approaches against this problem have been attempted.[0003]One example of the approaches includes reduction in thermal expansion of insulating layers for use in printed circuit boards. This approach is to suppress the warpage by bringing the coefficient of thermal expansion of a printed circuit board closer to th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): C08L79/08C08G73/12C08K3/36C08K7/18C08J5/24C08J7/12H05K3/38H05K1/03H05K3/18C25D3/38
CPCC08L79/085C08G73/128C08K3/36C08K7/18C08J5/24C08J7/12H05K3/389H05K1/0373H05K3/181H05K3/188C25D3/38C08J2379/08C08J2465/00C08L2203/20H05K2203/0786H05K2201/0162H05K2203/0723H05K2203/072C08G73/00C08K5/541C08L35/00C08L101/00H05K1/03H05K3/38C09D179/085C08J5/244C08J5/249C08K5/5425C08L61/14C08F220/06C08J5/043C08K3/22C08L63/00C08L101/02H05K3/381H05K1/0386
Inventor TOMIZAWA, KATSUYATAKAHASHI, HIROSHISHIGA, EISUKE
Owner MITSUBISHI GAS CHEM CO INC