Method for producing semiconductor epitaxial wafer and semiconductor epitaxial wafer

a technology of epitaxial wafers and semiconductors, applied in the direction of crystal growth process, test/measurement of semiconductor/solid-state devices, after-treatment details, etc., can solve the problems of device production process, cracks that extend, etc., to suppress crack extending and contamination of production lines, and achieve complete crack-free semiconductor epitaxial wafers. , the effect of reducing the number o

Inactive Publication Date: 2018-08-30
SHIN-ETSU HANDOTAI CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

This patent text describes a method for making semiconductor epitaxial wafers that have no cracks, peeling of the epitaxial layers, or other damage. By observing the outer edge of the fabricated wafer and removing the problem areas, it is easy to create a completely crack-free semiconductor epitaxial wafer that helps prevent contamination of the production line during subsequent device production processes. The technical effect of this method is the improvement of semiconductor wafer quality and reliability.

Problems solved by technology

It is feared that this crack extends in a device production process and a production line is contaminated by inducing peeling of an epitaxial growth layer in a device production process.

Method used

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  • Method for producing semiconductor epitaxial wafer and semiconductor epitaxial wafer
  • Method for producing semiconductor epitaxial wafer and semiconductor epitaxial wafer
  • Method for producing semiconductor epitaxial wafer and semiconductor epitaxial wafer

Examples

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examples

[0076]Hereinafter, the present invention will be described more specifically with Example and Comparative Example, but the present invention is not restricted to these examples.

example

[0082]A semiconductor epitaxial wafer was fabricated in the same manner as Comparative Example.

[0083]After the outer edge portion of the fabricated semiconductor epitaxial wafer was observed with collimated light, a crack portion, an epitaxial layer peeling (epitaxial layer burr) portion, and a reaction mark portion on outer edge portion of the semiconductor epitaxial wafer were ground (subjected to terrace chamfering) by a grinding wheel in an area 10 mm wide and 50 μm deep.

[0084]The ground semiconductor epitaxial wafer is depicted in FIG. 2.

[0085]FIG. 2 (a) is a photograph of the ground semiconductor epitaxial wafer when the semiconductor epitaxial wafer is viewed from diagonally above, FIG. 2 (b) is a sectional view of the periphery portion of the ground semiconductor epitaxial wafer, and FIGS. 2(c) and 2(d) are enlarged photographs of an area near the border between an epitaxial layer portion and a terrace chamfered portion on the periphery portion of the ground semiconductor ep...

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Abstract

A method for producing a semiconductor epitaxial wafer, including steps of: fabricating an epitaxial wafer by epitaxially growing a semiconductor layer on a silicon-based substrate; observing the outer edge portion of the fabricated epitaxial wafer; and removing portions in which a crack, epitaxial layer peeling, and a reaction mark observed in the step of observing are present. As a result, a method for producing a semiconductor epitaxial wafer in which a completely crack-free semiconductor epitaxial wafer can be obtained, is provided.

Description

[0001]This is a Divisional of application Ser. No. 15 / 121,177 filed Aug. 24, 2016, which is a National Stage Application of PCT / JP2015 / 000597 filed Feb. 10, 2015, which claims the benefit of Japanese Application No. 2014-042815 (filed Mar. 5, 2014. The entire disclosures of the prior applications are hereby incorporated by reference herein their entirety.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present invention relates to a method for producing a semiconductor epitaxial wafer having an epitaxial growth layer on a silicon-based substrate and to a semiconductor epitaxial wafer.2. Description of the Related Art[0003]In order to produce a semiconductor epitaxial wafer, epitaxial growth is performed on the front surface of a silicon-based substrate (for example, a silicon substrate or a silicon carbide substrate) or the like by using a commercially available epitaxial production apparatus, whereby a hetero-homo epitaxial wafer is produced.[0004]In an epitaxial wafer...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): C30B33/00H01L21/02C30B25/00H01L21/66H01L29/32C30B33/10C30B29/40C30B25/18C23C16/56C23C16/34H01L29/20H01L21/78
CPCH01L21/02024H01L21/02381H01L21/0254C30B25/00H01L22/12H01L22/20H01L21/02378H01L29/32H01L21/02021H01L21/02019H01L21/02013C30B33/10C30B33/00C30B29/406C30B25/183C23C16/56C23C16/34H01L29/2003H01L21/7806H01L21/0262H01L21/02458
InventorHAGIMOTO, KAZUNORISHINOMIYA, MASARUTSUCHIYA, KEITAROGOTO, HIROKAZUSATO, KENSHIKAUCHI, HIROSHIKOBAYASHI, SHOICHIKURIMOTO, HIROTAKA
OwnerSHIN-ETSU HANDOTAI CO LTD