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Triple modular redundancy flip-flop with improved power performance area and design for testability

a technology of modular redundancy and flip-flops, applied in pulse generators, pulse techniques, instruments, etc., can solve the problems of affecting the noise of data retained by flip-flops during sequential delivery, and severely compromising the safety of humans relying on such systems

Active Publication Date: 2022-04-07
QUALCOMM INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The data retained by the flip-flops during the sequential delivery may be affected by noise, such as terrestrial radiation.
If such flip-flops are employed in safety-related systems, such as automotive or avionics systems, the consequence of an unintended change in the state of one or more flip-flops (e.g., one or more SEUs) may severely compromise the safety of humans relying on such systems.

Method used

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  • Triple modular redundancy flip-flop with improved power performance area and design for testability
  • Triple modular redundancy flip-flop with improved power performance area and design for testability
  • Triple modular redundancy flip-flop with improved power performance area and design for testability

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Embodiment Construction

[0027]The detailed description set forth below, in connection with the appended drawings, is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of the various concepts. However, it will be apparent to those skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring such concepts.

[0028]Computing systems involving safety of humans are often designed to be more fault tolerant than commercial computing systems that typically do not impact human safety. If a commercial computing system is affected by a fault due to noise, such as terrestrial radiation, the system may simply be rebooted, as there are generally no consequences to h...

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Abstract

A triple modular redundancy (TMR) flip-flop includes a set of master-gate-latch circuits including a first set of inputs to receive a first digital signal, and a second set of inputs to receive a clock; and a voting logic circuit including a set of inputs coupled to a set of outputs of the set of master-gate-latch circuits, and an output to generate a second digital signal based on the first digital signal. Another TMR flip-flop includes a set of master-gate-latch circuits to receive a set of digital signals in response to a first edge of a clock, respectively; and latch the set of digital signals in response to a second edge of the clock, respectively; and a voting logic circuit to receive the latched set of digital signals; and generate a second digital signal based on a majority of logic levels of the latched first set of digital signals, respectively.

Description

FIELD[0001]Aspects of the present disclosure relate generally to data flip-flops, and in particular, to a triple modular redundancy flip-flop with improved power performance area (PPA) attributes and design for testability (DFT) capability.DESCRIPTION OF RELATED ART[0002]Data flip-flops are used in computing circuits to sequentially deliver data through various sub-circuits and combinational logic. The data retained by the flip-flops during the sequential delivery may be affected by noise, such as terrestrial radiation. For example, terrestrial radiation directed at a node of a flip-flop may cause the flip-flop to unintendedly change state or flip (e.g., from a logic one (1) to a logic zero (0), or vice-versa). This is sometimes referred to as a single event upset (SEU). If such flip-flops are employed in safety-related systems, such as automotive or avionics systems, the consequence of an unintended change in the state of one or more flip-flops (e.g., one or more SEUs) may severely...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H03K19/003G06F11/18H03K3/013
CPCH03K19/00338H03K3/013G06F11/184H03K3/037H03K3/0372H03K3/356121H03K3/35625H03K3/012H03K19/23
Inventor RAO, HARIGELIN, RENAUD FRANCOIS HENRI
Owner QUALCOMM INC
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