Solid-state image sensor and method for fabricating the same

Abstract

A solid-state image sensor comprises a semiconductor substrate of a first conductivity type having a color pixel region and a black pixel region; a first well of the first conductivity type formed in the color pixel region; a second well of the first conductivity type formed in the black pixel region; a third well of a second conductivity type formed, surrounding the second well and isolating the second well from the rest region of the semiconductor substrate; a color pixel formed in the first well in the color pixel region and including a first photodiode and a first read transistor for reading a signal generated by the first photodiode; and a black pixel formed in the second well in the black pixel region and including a second photodiode and a second read transistor for reading a signal generated by the second photodiode. The first well includes a first buried impurity doped layer of the first conductivity type formed in a bottom thereof in a region where the first read transistor is formed. The second well includes a second buried impurity doped layer of the first conductivity type formed in a bottom thereof in a region where the second photodiode is formed and a region where the second read transistor is formed.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2004-209681, filed on Jul. 16, 2004, the entire contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]The present invention relates to a solid-state image sensor formed of CMOS and a method for fabricating the same.[0003]As a solid-state image sensor using semiconductor materials, an image sensor formed of CMOS (CMOS image sensor) is known.[0004]The CMOS image sensor includes a pixel unit shielded from light, which are called a black pixel unit (also optical black unit) in addition to a light receiving unit of color pixel unit. The black pixel unit is for generating a reference value of a pixel signal in a dark state for the prevention of changes of a signal level due to temperature changes, etc. Accordingly, it is preferable that the black pixel unit is formed isolatable from noises of the sur...

AI Technical Summary

Benefits of technology

[0012]An object of the present invention is to provide a structure of the solid-state image sensor comprising a color pixel array unit formed in the usual well and a black pixel array unit formed in an inner well of the double well, which ensures the compatibility with the fabrication process of the peripheral circuit transistors while realizing high sensitivity of the pixels, and a method for fabricating the solid-state image sensor having such the structure.

[0015]According to the present invention, in the solid-state image sensor, the pixel array unit is formed in a usual well, and the black pixel array is formed in an inner well of a double well, a buried impurity diffused region is provided between the photodiode of the black pixel and the outer well of the double well, whereby the photodiode and the outer well of the double well can be isolated from each other without failure. The buried impurity diffused region is not formed below the photodiode of the color pixel, whereby the depletion layer of the photodiode of the color pixel can extend deep in the substrate, and accordingly, the isolation between the photodiode and the outer well of the double well can be ensured without sacrificing the sensitivity of the photodiode of the color pixel.

[0016]In the color pixel, the peripheral end of the buried diffused layer of the photodiode and the peripheral end of the buried impurity diffused region with the color pixel formed in are sufficiently spaced from each other, whereby the depletion layer of the photodiode can extend sufficiently deep into the substrate. This increases the sensitivity of the photodiode.

[0018]The buried impurity diffused region to be formed in the pixel array unit is formed by ion implantation in a random direction, whereby the depth-wise distribution of the impurity has improved intra-plane uniformity, and the pixels can few fabrication fluctuations. The buried impurity diffused region in the peripheral circuit unit is formed by ion implantation in the direction normal to the substrate, whereby fluctuations of the device characteristics due to offsets of ion implanted parts and variations of the implanted depth near the photoresist end can be prevented.

[0019]A heavily doped region is formed on the bottom of the buried diffused layer of the photodiode of the black pixel, or the concentration of the buried impurity diffused region formed below the photodiode of the black pixel is made lower than a concentration in the rest region, whereby the potential of the photodiode of the black pixel can be made deep. This permits the potential depth of the photodiode of the black pixel to be approximate to the potential depth of the photodiode of the color pixel, and substantially the same saturated charge amount as that of the color pixel can be realized.

[0020]An impurity diffused region extended from the surface down to the vicinity of the bottom of the device isolation film is provided in the region between the read transistor formed region and the region between the photodiode and the device isolation film, whereby the ability of the isolation between the photodiode and the device isolation film can be further increased.

Problems solved by technology

The buried n-well and the buried n-type layer of the photodiodes are accordingly insufficiently electrically isolated, with a worst result that both may be electrically connected, causing operational defects.

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