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Memory circuit

a memory circuit and memory technology, applied in the field of memory circuits, can solve the problems of data error (bit error) locality, soft error, data error may be called soft error,

Active Publication Date: 2007-06-26
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0048]The above-mentioned division number K′ represents a distance (worst value) between error bits which cause the memory circuit a data error, in case where the particle is plunged parallel to the word line. The multi-bit soft error hardly occurs on using the division number K′ which is calculated as described above.
[0048]The above-mentioned division number K′ represents a distance (worst value) between error bits which cause the memory circuit a data error, in case where the particle is plunged parallel to the word line. The multi-bit soft error hardly occurs on using the division number K′ which is calculated as described above.
[0048]The above-mentioned division number K′ represents a distance (worst value) between error bits which cause the memory circuit a data error, in case where the particle is plunged parallel to the word line. The multi-bit soft error hardly occurs on using the division number K′ which is calculated as described above.
[0048]The above-mentioned division number K′ represents a distance (worst value) between error bits which cause the memory circuit a data error, in case where the particle is plunged parallel to the word line. The multi-bit soft error hardly occurs on using the division number K′ which is calculated as described above.

Problems solved by technology

By the way, the above-mentioned data error (bit error) may locally occur.
Such a data error may be called a soft error.
When the electron is absorbed into a latch node of the memory cell, the datum is destroyed in the memory cell so that the soft error occurs.
In the other words, the soft error is an error in which the data are locally destroyed in only parts into which the alpha ray or the neutron ray is plunged.
In as much as electrons, which are generated in the semiconductor substrate by each particle of the alpha ray and the neutron ray, have charges of 20 f-coulombs to 200 f-coulombs, there is a growing possibility that errors simultaneously occur in adjacent memory cells by the plunge of one particle.
Inasmuch as the data of (m+n) bits are read out of the memory cells of (m+n) that are adjacent to one another, in the conventional memory circuit, there is a drawback in which makes it impossible to correct the errors when the multi-bit soft error occurs in which a plurality of bit errors generates locally and simultaneously, as described above.
In other words, there is a drawback in which makes it impossible to correct the errors when bit errors having a bit number greater than a correctable one occur simultaneously due to the multi-bit soft error.
For example, there is a drawback in which it is impossible to correct the errors when the errors simultaneously occur in two bits due to the multi-bit soft error in the adjacent data of 7 bits as described above.

Method used

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embodiment 1

[0031]In FIG. 1, a reference numeral 21 represents a memory cell array. A reference numeral 22 represents a memory cell. A reference numeral 23 represents a sense amplifier circuit. Reference numerals 24a to 24d represent ECC circuits, respectively (Each of the ECC circuits 24a to 24d serves as an error correcting section). Data of (m+n) bits are read from and written to the memory cell array 21. The data of (m+n) bits are obtained by adding parity bits of n bits to data of m bits. The memory cell array 21 is divided into K bits arranged along a direction of a word line, where K represents a positive integer which is not less than two. Each unit having the K bits arranged along the direction of the word line will be called a memory unit. Successive memory units of (m+n) form a memory block. In the example being illustrated, K=4, m=4, and n=3. Each of the memory units is divided into 4 bits. The successive seven memory units form one memory block.

[0032]In FIG. 1, the memory units are...

embodiment 2

[0042]In FIG. 2, the same components as those of FIG. 1 are designated by the same reference numerals. A reference numeral 41 represents a spare memory unit (redundant memory unit). The spare memory unit 41 is similar in structure to each of the memory units 31 to 37. In other words, the spare memory unit 41 has memory cells 22 of 4 bits that are arranged along the word line. It will be assumed that a memory cell failure occurs in the memory unit 36 (for example, a defect based on manufacturing). The memory unit 36 is displaced with the spare memory unit 41. The first through the fourth rows 22a to 22d of the spare memory unit 41 are connected to the ECC circuits 24a to 24d, respectively.

[0043]A selection switch is used on displacing the memory unit 36 with the spare memory unit 41. More particularly, a laser repair fashion is used which sets the selection switch by a laser cutting. Although illustration is not made in FIG. 2, a laser repair fuse is cut so that a selector selects th...

embodiment 3

[0046]FIG. 4 shows a view for illustrating an example of a memory cell (SRAM cell) of an SRAM. T1 and T2 represent transistors, respectively. INT1 and INT2 represent inverters, respectively. A latch circuit is composed of the inverters INT1 and INT2 of two stages. A capacitance (including a parasitic capacitance) is given by Cs on a latch node. When each of the inverters INT1 and INT2 is supplied with a power voltage of Vcc, an accumulated charge is given by Cs×Vcc (coulombs).

[0047]When −Q (coulombs) represents a charge of an electron which generates on plunging the particle of the alpha ray or the neutron ray into the semiconductor substrate, the positive integer K′ which satisfies a relationship of K′>Q / (Cs×Vcc) is used as a division number.

[0048]The above-mentioned division number K′ represents a distance (worst value) between error bits which cause the memory circuit a data error, in case where the particle is plunged parallel to the word line. The multi-bit soft error hardly oc...

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Abstract

When to a memory cell array 21 a read / write operation is performed of the 7-bit data in which parity bits of 3 bits are added to data of 4 bits, an error correction is carried out in concern to each of the 7-bit data. The memory cell array is divided into memory units 31 to 37 each of which has four bits which are arranged along a direction of a word line. On writing the 7-bit data in the memory cell array, bits of the 7-bit data that are different from one another are written as written bit data along the direction of the word line in the memory units 31 to 37, respectively. In the 7-bit data, the written bit data has an interval of four bits. Error correcting circuits performs an error correction of the 7-bit data in each of the 7-bit data.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]This invention relates to a memory circuit having an error correcting function, and more particularly, to a memory circuit which is tough to a multi-bit error in which a plurality of bit errors generates locally.[0003]2. Description of the Prior Art[0004]FIG. 7 is a circuit configuration for illustrating a conventional memory circuit having an error correcting function (hereinafter, simply called memory circuit). In FIG. 7, a reference numeral 11 represents a memory cell array. A reference numeral 12 represents a memory cell. A reference numeral 13 represents a sense amplifier circuit. A reference numeral 14 represents an ECC (Error Check and Correction) circuit. In such a memory circuit, parity bits of n bits are added to data of m bits, where n represents a positive integer which is not less than one, and m represents a positive integer which is not less than two. When an error occurs in at least one bit on carrying o...

Claims

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Application Information

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IPC IPC(8): G11C29/00G11C11/413G06F11/08G06F11/10G11C7/00G11C7/24G11C11/401G11C29/42
CPCG06F11/1012G06F11/08
Inventor HATAKENAKA, MAKOTONII, KOJIMANGYO, ATSUOFUJINO, TAKESHI
Owner RENESAS ELECTRONICS CORP
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