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Light emitting device package and method of manufacturing the same

a technology of light emitting devices and light emitting devices, which is applied in the direction of optical elements, instruments, structural/machine measurement, etc., can solve the problems of increasing the cost and time required for manufacturing limiting the miniaturization and thin shaping and preventing the damage of the light emitting device. , the size, especially the thickness, of the light emitting device package is reduced

Active Publication Date: 2010-06-15
LG ELECTRONICS INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is a light emitting device package and a method of manufacturing it that solves problems in the related art. The package includes a mounting groove where a light emitting device is mounted using a bulk micro machining technology. The package also includes at least one diffusion layer that is electrically connected in parallel with the light emitting device, which eliminates the need for an additional protection device and reduces the size of the package. The method of manufacturing the package includes forming at least one diffusion layer on a substrate and insulating the first and second electrodes from the substrate while connecting them with the diffusion layer. The technical effects of the invention include improved protection against static electricity and reverse voltage, reduced size of the package, and simplified manufacturing process.

Problems solved by technology

However, the conventional light emitting device package has the following problems.
Consequently, the process for manufacturing the light emitting device package is complicated and troublesome, and therefore, costs and time necessary for manufacturing the light emitting device package are increased.
In addition, it is difficult to manufacture the conventional light emitting device package through plastic injection molding, and therefore, the miniaturization and thin shaping of the light emitting device package are limited.
Consequently, the conventional light emitting device package is not suitable for a current tendency requiring the reduction in weight and size of electronic products.

Method used

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  • Light emitting device package and method of manufacturing the same
  • Light emitting device package and method of manufacturing the same
  • Light emitting device package and method of manufacturing the same

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Experimental program
Comparison scheme
Effect test

first embodiment

[0041]In light emitting device package with the above-described construction according to the present invention, the light emitting device 300 is mounted in the mounting groove 110 formed at the package structure 100. Consequently, light generated from an active layer of the light emitting device 300 is effectively reflected forward (upward on the drawing), and therefore, the light emission efficiency of the light emitting device package is improved. Specifically, the first and second electrodes 141 and 142 formed at the inside surface of the mounting groove 110 serve as a kind of reflection mirror. Also, the light emitting device 300 is mounted on the first and second electrodes 141 and 142, which are formed on the insulation film 130 at the bottom surface region of the mounting groove 110 formed in the middle region of the upper part of the package structure 100, by a flip chip bonding process using a conductive bonding agent, such as the solder 440. Consequently, a troublesome pr...

second embodiment

[0044]According to light emitting device package with the above-stated construction, the diffusion layer 121 having a polarity opposite to that of the package structure 100 is formed at the package structure 100, and therefore, it is possible to realize the function of a protection device, such as a Zener diode, for protecting the circuit and the light emitting device from static electricity or reverse voltage. As a result, the provision of such a protection device is unnecessary, and therefore, a space for receiving the protection device is not needed. Furthermore, a mounting process, such as wire bonding, is omitted. Consequently, it is possible to miniaturize the light emitting device package, and it is possible to reduce costs and time necessary for manufacturing the light emitting device package. In addition, the light emitting device package according to this embodiment does not include any lead, and therefore, it is possible to reduce the thickness of the light emitting devic...

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Abstract

A light emitting device package and a method of manufacturing the same are disclosed. The light emitting device package includes a package structure, two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other, and first and second electrodes insulated from the package structure by an insulation film. The first and second electrodes are electrically connected with the two diffusion layers, respectively.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2006-0019562, filed on Feb. 28, 2006, which is hereby incorporated by reference in its entirety as if fully set forth herein.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a light emitting device package and a method of manufacturing the same, and more particularly, to a light emitting device package wherein no Zener diode is mounted in the light emitting device package, and therefore, the light emitting device package can be used as a thin surface mount device (SMD), and a method of manufacturing the same.[0004]2. Discussion of the Related Art[0005]Generally, it is possible for a light emitting device, such as a light emitting diode or a laser diode, using Group III to IV or Group II to VI compound semiconductor materials of a direct transition compound semiconductor to emit various color light, including red color lig...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): G02B6/00H01L29/207H01L29/267H01L33/44H01L33/50H01L33/56H01L33/62
CPCH01L33/486H01L25/167H01L33/62H01L2224/48091H01L2224/48137H01L2224/48257H01L2924/3025H01L2224/48247H01L2924/00014H01L2924/181H01L2924/00012B62D1/18G01M17/00
Inventor KIM, GEUN HO
Owner LG ELECTRONICS INC