Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device

Abstract

A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a sealed body including two substrates and a method for manufacturing the sealed body. Further, the present invention relates to a light-emitting device including an organic EL element and a method for manufacturing the light-emitting device.[0003]2. Description of the Related Art[0004]A technique in which a highly airtight sealed body is formed in such a manner that two substrates are bonded to each other by glass frit (also referred to as frit glass) including low-melting glass is known. In a technique disclosed in Patent Document 1, a paste containing a binder and a frit material including low-melting glass is applied to a glass substrate along an edge of the glass substrate, the binder is removed and the frit material is melted to form glass frit by baking of the paste, the glass frit is irradiated with laser light with the substrate overlapping with a counter substrate, and the glas...

AI Technical Summary

Benefits of technology

[0009]In general, a heating apparatus such as an oven or an annealing furnace is used for baking a paste. However, such a heating apparatus is large in size and it takes a long time to reach desired baking temperature due to heat capacity of a substrate. Accordingly, productivity is greatly affected by a long process time in a step of baking the paste, high initial cost and running cost of the heating apparatus, and the like.

[0036]According to an embodiment of the present invention, a highly productive method for sealing substrates with glass frit can be provided. Further, a method for sealing substrates with glass frit, which can be used for a substrate provided with a material with low heat resistance, can be provided. Further, a highly airtight sealed body manufactured in either method can be provided. A light-emitting device with high productivity and high reliability and a manufacturing method thereof can be provided.

Problems solved by technology

However, such a heating apparatus is large in size and it takes a long time to reach desired baking temperature due to heat capacity of a substrate.

Accordingly, productivity is greatly affected by a long process time in a step of baking the paste, high initial cost and running cost of the heating apparatus, and the like.

A substrate to which a paste is applied cannot be baked at high temperature in some cases.

For example, in the case where an organic substance with low heat resistance is formed over a substrate, heat treatment at high temperature cannot be performed on the substrate after a paste is applied to the substrate.

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