Dedicated evaporation cavity of semiconductor electronic refrigerator, and preparation method

Abstract

The present invention relates to a special-purpose evaporation cavity for semi-conductor electronic cryostat unit and its preparation method. It includes closed evaporation cavity communicated with two ends of heat tube, said evaporation cavity is a solid structure whose interior is equipped with a closed tube line or capillary microgap, said closed tube line or capillary microgap has an opening, said opening is communicated with the opening of heat tube on the evaporation cavity surface. Said evaporation cavity is made up by using nonferrous metal with high heat-conducting coefficient through the processes of extrusion, die-casting, machining and pouring formation.

Description

technical field [0001] The invention belongs to the field of semiconductor electronic refrigeration and heat transfer, in particular to an evaporation chamber used in conjunction with a semiconductor electronic refrigeration device and a preparation method thereof. Background technique [0002] At present, when semiconductor electronic refrigeration works, there are mainly three forms of heat dissipation at the hot end: ①The solid aluminum profile is bonded to the hot end of the semiconductor electronic refrigerator, and a fan is added for forced heat exchange. ②Water cooling method is adopted, that is, the metal cavity attached to the hot end of the semiconductor electronic refrigerator is filled with heat transfer medium, namely water. Using the pump as power, the working medium water in the metal cavity is forced to flow, and the heat is exchanged in the circulating flow. ③ Using heat pipe heat transfer technology, select a plane of the hollow evaporation chamber to be b...

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Problems solved by technology

However, the limitations of the life of the water pump, working noise, and water sources prevent it from being widely used.

The third method overcomes the problems of noise and service life caused by the forced heat dissipation in the first two methods due to the use of heat pipe phase change heat transfer, but there are: 1. The working pressure of the hollow trapezoidal evaporation chamber of the heat pipe radiator is relatively high. Large and easy to cause deformation of the bonding surface of the evaporation chamber due to excessive pressure, affecting the bonding degree, which in turn increases the contact thermal resistance of the bonding surface and leads to low heat transfer efficiency

2. Due to the complex manufacturing process of the hollow trapezoidal evaporation chamber, it can only be completed by three times of stretching and deformation of the steel plate, and then through shaping, welding, grinding and other processes.

3. Since the heat transfer base surface of the hollow trapezoidal evaporation chamber is limited by the material and shape, the heat is subjected to the thermal resistance formed by the thermal conductivity coefficient of the material and the heat transfer area during the transfer process, so that the heat transfer efficiency cannot meet the normal requirements of semiconductor electronic refrigerators. work needs

4. The hollow trapezoidal evaporation chamber and the circulation pipes of each heat pipe need to be welded to form a closed and pressure-bearing circulation loop. Since the hollow trapezoidal evaporation chamber is formed by stretching the plate before forming, the formation of the evaporation chamber requires multiple welding points. The long welding seam not only increases the difficulty of the welding process, but also increases the coefficient of microleakage and leakage during the use of the product, and the refrigeration performance of the product is unstable.

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