Preparation method of thin film transistor matrix substrate
A technology of a thin film transistor and a manufacturing method, which is applied in the field of manufacturing a thin film transistor matrix substrate, can solve problems such as difficult control, and achieve the effects of reducing damage, improving device characteristics, and reducing manufacturing costs
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[0024] Please refer to FIG. 2A to FIG. 2F . FIG. 2A to FIG. 2F are schematic cross-sectional views showing a manufacturing process of a reverse-staggered channel etch-protected transistor matrix substrate according to a preferred embodiment of the present invention. Please refer to FIG. 2A, on the transparent substrate 200, a conductive layer is defined by a mask process to form the gate electrode 202, the lower electrode 204 of the storage capacitor, and the signal electrode 206 to connect with the gate electrode pad 208 and the signal electrode. MAT 209. The transparent substrate 200 may be a glass substrate; the material of the conductor layer may be a group consisting of aluminum, molybdenum, copper, an alloy formed by any combination thereof, and metal nitride. The conductor layer can be a single-layer or multi-layer structure formed of the aforementioned materials.
[0025] Please refer to FIG. 2B, a gate dielectric layer 210, a semiconductor layer 212 and a protective ...
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