Flash memory card

Abstract

A memory card comprising a substrate, a memory die on top of the memory die, a controller die on top of the memory die; and a interposer surrounding the controller die and on top of the memory die wherein the interposer allows for wire bonding to the substrate to be minimized. A system and method in accordance with the present invention achieves the following objectives: (1) increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies when stacking is necessary, to increase density of the Flash card; (3) has only a few necessary signal I / O bonding wires to the substrate to improve production yield.

Description

technical field [0001] The invention relates to a flash memory, more specifically, to a high-density flash memory card. Background technique [0002] The application of flash memory card is mainly required by mass consumer electronics products, such as digital still camera, mobile phone, PDA or MP3 player, etc. These products are all developing towards smaller packaging and high density. As packaging methods become smaller and device densities become higher, there is a need for innovative ways to include multiple flash memory devices within the limited space of a particular flash memory card. [0003] It is known to handle higher density packed flash memory cards by wire bonding one or more flash dies and a flash controller. Physically, a flash die is typically much larger than a flash controller die. The flash die and the flash controller are independently wire-bonded on the substrate of the flash card. [0004] The substrate usually has interconnect traces to connect th...

AI Technical Summary

Problems solved by technology

Furthermore, due to the necessity of staggering bonding wires applied to multi-layer wafer layers, there will also be problems in production yield

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