Method for preparing film from material and its organic electroluminescent device
A film-forming method and luminescent technology, which are applied in the direction of electroluminescent light sources, electric light sources, electrical components, etc., can solve problems such as short circuits, no bright spots, and low device performance, so as to achieve good device performance, increase film-forming speed, and improve The effect of production efficiency
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Embodiment 1
[0019] Example 1: Preparation of dual source AlQ film with same speed
[0020] 1. Preparation of AlQ material and evaporation source: Put the same weight of AlQ material into two same crucibles, put them into different evaporation sources in the same vacuum chamber, and evacuate to 1.6×10 -4 Pa.
[0021] 2. Preparation of dual-source AlQ film at the same speed: place the silicon substrate with a clean and flat surface in the vacuum chamber, and transfer it to the chamber containing the AlQ material, and vacuum to 1.6×10 -4 Pa, adjust the deposition rate of the AlQ material in the two evaporation sources, make the deposition rate of the AlQ material of the two evaporation sources basically the same, both are 0.25nm / s, start the deposition, observe the film thickness detector of the two AlQ evaporation sources The film thickness indicates that the deposition is stopped at the same time when the film thickness of the two AlQ evaporation sources reaches 60nm.
Embodiment 2
[0022] Example 2 Preparation of dual source AlQ film with different speed:
[0023] The preparation process is the same as that in Example 1, except that during the evaporation process, the evaporation rate of the dual source is controlled to 0.4 nm / s and 0.1 nm / s, respectively.
Embodiment 3
[0030] Example 3: Preparation of dual source AlQ device with same speed
[0031] 1. Cleaning the glass substrate with ITO pattern pre-engraved: Use hot detergent ultrasonic and deionized water ultrasonic method to clean the glass substrate with ITO pattern pre-engraved, and dry it in a clean oven after cleaning.
[0032] 2. Transfer the substrate into the vacuum chamber and vacuum to 1.6×10 -4 Pa.
[0033] 3. Deposit a layer of hole transport material NPB on the ITO substrate with a deposition rate of 0.2nm / s and a film thickness of 50nm.
[0034] 4. A layer of organic luminescent material AlQ is deposited on the hole transport material NPB using a dual-source same-speed film forming method. The film thickness of AlQ is 60nm, and the deposition rate of dual-source AlQ is 0.25nm / s.
[0035] 5. Preparation of LiF layer: transfer the substrate to the chamber where the metal cathode is prepared, and vacuum to 1.6×10 -4 Pa, deposit a layer of LiF on the AlQ layer with a thickness of 0....
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