X ray diffraction instrument and method for detecting macro stress in micro area

Abstract

The X-ray diffraction device and method for detecting macroscopic stress in a micro region of the invention belong to the testing field. The setup, consisting of an x-ray diffractometer, is equipped with a rotating detection stage. Detection steps: adjust the surface of the tested sample on the rotating detection platform to be perpendicular to the diffraction circle platform of the X-ray diffractometer, and set the roll rotation axis on the intersection line between the diffraction circle plane and the sample surface; select the stress detection point O under the microscope; Angle Φ sets the stress detection direction; determine the roll angle α; re-observe the stress detection point O under the microscope, adjust the detection point O to coincide with the center of the diffraction circle; measure the selected diffraction crystal plane; Several 2θα data; calculate the macroscopic stress value in the direction perpendicular to the roll axis AB in the small area of ​​point O. The invention can detect the macroscopic stress in any specified direction in any specified tiny area of ​​the sample, and detect the stress change gradient and stress distribution inhomogeneity.

Description

technical field [0001] The invention belongs to the field of testing, in particular to an X-ray diffraction testing method for macroscopic stress variation gradients and macroscopic stress distribution inhomogeneities in tiny regions. Background technique [0002] For semiconductor photosensitive and gas-sensitive thin film devices, large-scale electronic integrated devices, and some small precision instrument parts, macroscopic stress is unavoidable in the manufacturing process. This macroscopic stress not only damages the mechanical properties of the device but also has a non-negligible impact on the optoelectronic properties of the device. Therefore, it is necessary to accurately detect this macroscopic stress. [0003] Macroscopic stress x-ray inspection of current materials is usually recommended on wide-angle x-ray diffractometers or dedicated x-ray stress instruments. For its detection method, see "X-ray Stress Measurement Method", An Zhengzhi, Wang Wenyu, Jilin Uni...

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Problems solved by technology

[0004] Due to the large X-ray irradiation area (i.e. analysis and detection area) of this type of instrument, for example, the minimum detection area of ​​a special X-ray stress detector is: 2mm×3mm=6mm 2 In many cases, it is larger than the detectable surface of the above-mentioned thin-film devices and precision instrument parts, so it is difficult to achieve effective macroscopic stress detection, and of course it is impossible to analyze the stress change gradient and stress distribution inhomogeneity of the above-mentioned tiny devices detection

And the special equipment has a single function and the cost is also high

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