Heat radiation insulation resin composition and printing circuit board using same

Abstract

The present invention provides a heat dissipation insulating resin composition which exhibits heat dissipation useful for encapsulation baseboards, surface installation type light-emitting diodes etc.and exhibits excellent stability in storage, as well as a printed circuit using the same. Said heat dissipation insulating resin composition provided is characterized in that (A) ceramic particles forradiating far infrared rays and (B) solidifying resin compositions are contained therein, wherein the volume occupation rate of (A) is 60 volume% of the total volume of the condensate. There is alsop rovided a printed circuit using said composition.

Description

technical field [0001] The present invention relates to an insulating resin composition excellent in heat dissipation and a printed circuit board using the same. A heat-dissipating insulating resin composition and a printed circuit board using the same. Background technique [0002] In recent years, along with miniaturization and higher performance of electronic equipment, higher density and higher functionality of semiconductors are required. Therefore, circuit boards on which semiconductors are mounted are also required to be compact and high-density. As a result, the heat dissipation of components and circuit boards has recently become a major issue. [0003] In view of this, as a circuit board with good heat dissipation, a metal base board is mentioned, which uses a metal plate such as copper or aluminum, and electrically insulates one or both sides of the metal plate with a prepreg or a thermosetting resin composition. The layers form a circuit pattern (see, for exam...

AI Technical Summary

Problems solved by technology

The solder resist composition (see, for example, Patent Document 2) and the interlayer insulating material used in this package substrate use a low-molecular-weight epoxy compound as a matrix, and the filling material is also a carbon dioxide with good electrical insulation and chemical resistance. Silicon or precipitated barium sulfate, lack of heat dissipation

In addition, when using alumina, which is expected to have heat dissipation, electrical insulation, and chemical resistance, as a filler, the sedimentation of the filler is severe, and the settled filler aggregates and solidifies, so it cannot be used, and it is not practical in terms of storage stability.

[0006] In response to this, a method of attaching a heat sink to the upper part of the semiconductor is also considered, but since about 50% of the released heat is accumulated on the package substrate, the heat dissipation of the package substrate is still a problem

[0007] In addition, in recent mobile phones and the like in which a plurality of surface-mounted light-emitting diodes are used for button displays, there is a problem that most of the heat emitted by the light-emitting diodes is accumulated on the substrate.

Specifically, for example, in a surface-mounted light-emitting diode in which a light-emitting diode chip is disposed on a resin insulating layer with a terminal portion formed thereon, and the upper portion thereof is encapsulated with a sealing resin that also has a lens layer, the heat dissipation of the above-mentioned resin insulating layer becomes a problem.

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