Method for optimizing route for exposing wafer

Abstract

A method for optimizing exposure path of wafer includes generating initial exposure path as per limited condition, calculating duty time of said path, storing said path as better path and entering it into circulation, generating new exposure path after partial revision and judging whether said new path is legal one or not as per limited condition, calculating duty time of each legal path when it is generated, comparing duty time of legal path with that of better path and using the one with less duty time as better path, withdrawing from circulation when condition is satisfied.

Description

technical field [0001] The invention relates to photolithography technology, in particular to a method for planning wafer exposure paths. Background technique [0002] The semiconductor chip manufacturing process consists of a series of complex physical and chemical treatment processes on the surface of silicon wafers. Among them, the more important photolithography process, or more specifically, photolithography, is mainly a part of the reticle or semiconductor circuit mask. Or multiple graphics, after being irradiated by exposure light, the optical imaging system will project and transfer the graphics onto the wafer, glass and other substrates coated with photoresist photosensitive materials, and form one or more circuits on the wafer through the subsequent process , and cut it into independent chips (die, the core of the integrated circuit), and finally package the tested chips into product chips. [0003] In the above-mentioned photolithography process, the area exposed...

AI Technical Summary

Problems solved by technology

It can be seen from the figure that the planning method of the "S" shape and "Z" shape exposure path is very simple, only need to scan line by line according to the specified path, but because of this fixed pa

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