Device suitable for roasting a substrate

Abstract

The invention provides a device for baking one base plate, comprising a container, a heating device, and a preheating device, wherein, the container has a main body, a cover plate and a sealing device; the main body has an opening, at least one gas inlet and at least one gas outlet; the cover plate covers the opening, to form a containing space with the main body to contain the base plate; the sealing device is between the main body and the opening; the heating device is used to bake the base plate; the preheating device supplies circulated hot gas to the gas inlet, via the surface of base plate to enter into the gas outlet.

Description

【Technical field】 [0001] The present invention relates to a device for baking a substrate; in particular, relates to a substrate baking device for removing photoresist volatiles. 【Background technique】 [0002] In the front-end manufacturing process of thin film transistor liquid crystal display (TFT LCD) and color filter (color filter), the photoresist (photo-resist) used in the yellow light manufacturing process (photo process) ), after coating, the photoresist on the glass surface has a high solvent content and needs to be placed in an oven for pre-bake before exposure. During the pre-bake heating process, a large amount of solvent and photoresist organic gas volatiles will be generated on the glass surface, so it is necessary to design a gas flow system for the oven to reduce the subsequent impact of volatiles on the manufacturing process. [0003] The current design is drawn by exhaust holes on both sides of the oven, as shown in Figure 1. The substrate baking device ...

AI Technical Summary

Problems solved by technology

[0004] Because the cover plate 13 on the chamber 15 is not designed to be sealed and heat-insulated, the gap 17 between the cover plate 13 and the chamber 15 will make the external cold air be affected by the negative pressure generated by the exhaust force, and will affect the higher temperature. Photoresist volatilization gas causes thermal shock, resulting in undesired residues, which condense on specific positions on the substrate, making it easy for the undesired photoresist residues to drip on the glass surface of the substrate during the subsequent manufacturing process, affecting subsequent production The operation of the machine; it also leads to the common defect of the exposure machine, which needs to be shut down to clean the mask, and the machine needs to be shut down for regular maintenance. The proportion of pre-maintenance (PM) is high, which seriously affects the production capacity , and at the same time have a certain degree of impact on the wafer manufacturing (referred to as fab, fabrication) environment

[0005] Therefore, in order to avoid the thermal shock caused by the cold air sucked into the chamber due to the negative pressure, and then reduce the photoresist volatiles to remain on the glass surface and affect the manufacturing quality, the industry urgently needs a method that can effectively isolate the cold air from the outside and can eliminate it. Technology of organic volatile gas inside the chamber

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