Residue removing method after circuit board laser drill processing

Abstract

The invention relates to a slag removing method of circuit board laser drilling hole, which coats dry membrane on the circuit board, and drills, therefore, the generated copper slag is above dry membrane, and the dry membrane can be removed after drilling to remove the copper slag.

Description

technical field [0001] The invention relates to a drilling method, in particular to a method for removing residues after laser drilling of circuit boards, in particular to a method for protecting circuit boards after processing and providing circuit boards after completion. Background technique [0002] In the production of circuit boards in the prior art, in addition to forming circuits on the circuit board, perforations must also be provided on the circuit board to provide plug-in installation of various electronic components, or to provide them as circuit boards. It is used for the conduction of the circuit between the upper layer and the lower layer. Therefore, drilling the circuit board, especially the processing and application of the circuit board of the multi-layer board, is indeed an extremely important and necessary process. [0003] As far as the currently used drilling processing method is concerned, please refer to Fig. 5 and Fig. 6, wherein the circuit board 40...

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Problems solved by technology

[0003] As far as the currently used drilling processing method is concerned, please refer to Fig. 5 and Fig. 6, wherein the circuit board 40 is covered with metal copper skin 41 on the upper and lower surfaces of the non-conductive plate, and the perforated hole is to be set. The position is drilled by drilling 42 technology, for example: using laser drilling, so when the drilling 42 is performed, the cut copper slag will be splashed on the copper skin 41, which will affect the subsequent The production of the circuit may affect the correctness of the circuit; moreover, the fluff formed on the surface of the copper surface of the multi-layer circuit board after blackening treatment, if it is not properly protected during drilling , will affect the processing stability of its laser processing

[0004] It can be understood from the above description that the prior art is drilling the circuit board, if the copper slag splashed out is not completely and reliably removed, it will have a great adverse effect on the subsequent process of the circuit board

[0005] This shows that above-mentioned existing drilling method obviously still has inconvenience and defect in method and use, and demands urgently further improving

In order to solve the problems existing in the drilling method, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general method has no suitable method to solve the above problems. Obviously, it is a problem that relevant industry players are eager to solve.

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