Copper/zinc/silicon alloy, use and production thereof
An alloy, cu-zn-si technology, applied in the field of copper-zinc-silicon alloys, can solve the problems of uneven material, mechanical properties changes, expensive and other problems, and achieve the effect of low corrosion rate and high corrosion resistance
Active Publication Date: 2007-08-22
DIEHL METAL STIFTUNG & CO KG
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Problems solved by technology
This oxide scale adheres only loosely to the metal and can be easily peeled off, and is distributed throughout the production facility, with the result that these are disturbingly contaminated
Cleaning the production equipment is very expensive and laborious, resulting in high production costs
Another disadvantage of the currently known Cu-Zn-Si alloys is that the mechanical properties of the material vary in the direction of the long workpiece due to the inhomogeneity of the material
Method used
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[0020] An embodiment will be explained in more detail with reference to the drawings and the following description. In this attached drawing:
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Abstract
A Cu-Zn-Si alloy includes, in % by weight, 70 to 80% of copper, 1 to 5% of silicon, 0.0001 to 0.5% of boron, up to 0.2% of phosphorus and / or up to 0.2% of arsenic, a remainder of zinc, plus inevitable impurities. Products using the alloy and processes for producing the alloy are also provided. The alloy is distinguished by an improved resistance to oxidation and by uniform mechanical properties.
Description
technical field [0001] The present invention relates to copper-zinc-silicon alloys and the use and preparation of such copper-zinc-silicon alloys. Background technique [0002] The immediate requirements for copper-zinc-silicon alloys are that they are dezincification resistant and machinable. To date, good machinability of such brass alloys has been achieved by the addition of lead, as described, for example, in EP 1 045 041 A1. Recently, however, lead-free brass alloys having good machinability have also been developed, as described, for example, in EP 1 038 981 A1 and DE 103 08 778 B3. Both lead-free and lead-containing Cu-Zn-Si alloys tend to oxidize and form scale layers at temperatures between 300°C and 800°C. This scale layer adheres only loosely to the metal and can be easily peeled off and is distributed over the entire production plant, with the result that these are disturbingly contaminated. Cleaning the production equipment is very expensive and laborious, re...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/04
CPCC22C9/04C22C9/10
Inventor H·施特罗布尔K·施瓦姆H·迈尔N·加格U·雷克塞尔K·马斯塔勒
Owner DIEHL METAL STIFTUNG & CO KG
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