Fixer andits scanning electronic microscope for testing sample

A technology for electron microscopes and fixtures, which is applied in microscopes, semiconductor/solid-state device testing/measurement, circuits, etc. It can solve problems such as low test efficiency, sample drop, and image blurring, so as to improve sample manufacturing efficiency and speed. The effect of simple structure
CN101030518AInactive Publication Date: 2007-09-05SEMICON MFG INT (SHANGHAI) CORP +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SEMICON MFG INT (SHANGHAI) CORP
Publication Date
2007-09-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention is concerned with the fixing equipment for testing sample, which is used for test semiconductor chip, it includes: the fixing part, the compacted part and the base; the fixing part sets on the base that is with the fixing wall plumbing with the base, the compacted part consists of the active wall that plumbs with the base; forms the space between the fixing wall, the active wall ad the base that is used for fixing the testing sample. The invention is: improving the SEM imaging quality because the sample fixes on the fixing equipment and will not appearing vibrate during the scanning; improving the productivity and testing speed because the width of the sample is adjustable, which provides a multiple production.
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Description

technical field

[0001] The invention relates to the field of semiconductor chip analysis, in particular to a sample fixing device on a scanning electron microscope sample stage during the preparation and analysis of test samples. Background technique

[0002] With the development of semiconductor integrated circuits, electron microscopes are more and more widely used in the microstructure analysis of products. IC (Integrated Circuit) manufacturing is basically built up by layers of patterns, and in order to understand the structure of the stacked patterns to improve the process or solve the failure problem in the process, it is often observed through an electron microscope by using a destructive cutting method , while cutting the cross section (CROSS SECTION) and observing the (crystal garden) cross section are the most basic means to detect the quality of the process. Electron microscopes generally include scanning electron microscope SEM (Scanning Electron Microscopy), tr...

Claims

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