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Method of forming a coating on a substrate, and a coating thus formed

A technology for substrates and coatings, applied in coatings, electrical components, circuits, etc., can solve the problems of high yield loss and achieve the effect of simple coating process

Inactive Publication Date: 2007-09-05
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Given that the coating is intended to be used as a protective coating for electronic devices, especially integrated circuits, yield loss is a significant problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Tetraethyl orthotitanate (TEOTi) was used as the matrix precursor component (yielding TiO 2 porous matrix), TiN particles as filler components, and then TEOTi (to produce TiO 2 ) as a precursor reinforcing component to prepare the porous protective coating according to the invention.

[0038] For this, 1 g of TEOTi was added to a solution of 0.3 g of HCl (6M) in 14.5 g of ethanol. To this solution was added 4.58 g of TiN to obtain a 4.4% by volume solution (thus obtaining 2 The porous matrix is ​​91% by volume of the filler component TiN).

[0039] To obtain a substantially uniform coating liquid, use ZrO 2 The grinding beads (2 mm diameter) were ground for 21 hours in a 60 ml PE-bottle and rotated at about 120 revolutions per minute (rpm). Added ZrO 2 The amount of beads is such that they are just below the surface of the coating liquid.

[0040] The resulting suspensions were sequentially deposited on glass substrates by spin coating. While the substrate was sp...

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PUM

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Abstract

The present invention relates to a method of forming a protective coating on an electronic substrate such as an IC, the protective coating having a good mechanical, chemical and physical resistance and providing a suitable non-transparency. According to the present invention a porous matrix (preferably comprising Ti02) is formed, which is filled with a filler component which can absorb or scatter light, such as TiN particles. After a curing step, a reinforcing precursor component is added. In preparing the protective coating a predetermined amount of the filler component is used in order to obtain at least 40 vol.% of the filler component in the protective coating eventually obtained, based on the porous matrix obtained.

Description

technical field [0001] The present invention relates to a method of forming a coating on a substrate comprising the steps of forming a porous structure and at least partially filling the porous structure with a second solution. [0002] The present invention also relates to compositions for forming porous structures. The invention further relates to a substrate on which a coating obtainable by the method according to the invention is arranged. Background technique [0003] Such a method and such a device are known from EP-A 560485 . Known coatings are ceramic coatings filled with siloxane polymers, for example composed of silicon dioxide compounds such as SiO 2 - mesh) composition. The hydrogen silsesquioxane resin was placed in an oxygen plasma reactor and heated to 250° C. while being treated with oxygen plasma for 3 hours, thereby obtaining a silicon dioxide compound. As indicated in the related patent application EP-A 775680 (column 4, lines 48-51), this process prod...

Claims

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Application Information

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IPC IPC(8): C03C17/00H01L23/29C03C17/34
CPCC03C17/3435H01L2924/0002C03C2218/113C03C17/3411C03C2217/475C03C2217/45H01L23/585H01L2924/3011H01L23/291C03C2218/116C03C2217/425C03C17/007
Inventor 达尼埃尔·贝伦彼德拉·E·德容格
Owner NXP BV
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