Device for measuring Seebeck coefficient and resistivity of semi-conductor film material

Abstract

The present invention discloses a device used for measuring seebeck coefficient and electrical resistivity of semiconductor film materials at room temperature, wherein a thermopile and a heat conduction copper block having cold and heat terminals are integrated into a whole block, a cavum is formed at the lower part of the block, and an electric potential probe is deposited in the cavum. The seebeck electric potential detection points and the cold / heat ends thermocouple are deposited at the lower end of the heat conduction copper block; the electric potential probe, the detection points and the thermocouple are connected respectively to a gathering module; a reference resistor is connected in serial to a conversion switch and is also connected to the detection points; a constant current source is connected to the conversion switch; the conversion switch is connected to a data gathering module; the data gathering module is connected to a computer wherein gathered data is processed through a virtual instrument software to obtain the detection results. A detection platform is divided into two parts, wherein the upper part is used for fixing detection modules, and the lower part is used for supporting samples and has a screw used for lifting samples upwards to achieve a contact of samples and detection points. Said device is capable of perform a measurement of seebeck coefficient and electrical resistivity at the same time without destroying the thin film; furthermore, the measuring course is simple, and both the device lost and the testing cost are lower.

Description

technical field [0001] The invention belongs to the technical field of semiconductor testing devices, in particular to a device for measuring the Seebeck coefficient and resistivity of semiconductor thin film materials. Background technique [0002] Seebeck coefficient and resistivity are important thermoelectric transport performance parameters of materials. Accurate determination of them has very important application value and theoretical significance for in-depth study of thermoelectric transport mechanism of semiconductor materials, especially for in-depth research and development of new semiconductor thermoelectric materials and devices. Many devices for testing film resistivity have been developed at present, but there are few test devices for film Seebeck coefficient. Existing test devices related to film Seebeck coefficient and resistivity mainly have the following problems: 1) The determination of the Seebeck coefficient is usually determined by the temperature di...

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Problems solved by technology

Many devices for testing film resistivity have been developed at present, but there are few test devices for film Seebeck coefficient. Existing test devices related to film Seebeck coefficient and resistivity mainly have the following problems: 1) The determination of the Seebeck coefficient is usually determined by the temperature difference method at both ends, and the resistivity measurement is usually measured by the four-probe method (see ①M.Trakalo, Rev.Sci.Instrum., 1984, 55(5): 754; ②A.A .Ramadan, Thin Solid Films, 1994, 239: 272-275), so the tests of Seebeck coefficient and resistivity are basically carried out separately through different test devices, the test instruments cannot be universal and the measurement process is complicated and time-consuming; 2) A few studies combined the two, but microfabrication techniques were required to process the film and the substrate, making the test expensive, the process complicated, and the treatment of the sample also destructive (see ① R. Venkatasubramani an, 17th International Conference on Thermoelectrics, Nagoya University, Nagoya, Japan, May 24-28, 1998, 191-197; ②G. Chen, 20th International Conference on Thermoelectrics, Beijing, China, June 11-18, 2001, 30-34)

[0003] In short, most of the existing test devices use different instruments to test resistivity and Seebeck coefficient, and the instruments for testing Seebeck coefficient are still quite small, resulting in waste of hardware resources, and the functions are fixed and single, difficult to expand, and inconvenient to operate; In addition, the test process of a small number of devices that have realized the combination of the two is quite complicated, requiring the use of sophisticated micro-processing technology, which is very costly, and these operations are also destructive to the film; in terms of temperature difference realization, most instruments are used in the sample. Devices such as micro-heaters or radiant heating are placed at one end, which increases the complexity of the instrument and increases the cost of testing

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