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Sn-Zn series leadless solder alloy and its preparation method

A lead-free solder and alloy technology, used in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of poor wettability and easy oxidation, and achieve low cost, good wettability and excellent oxidation resistance. Effect

Inactive Publication Date: 2007-10-24
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of this invention is to provide a kind of Sn-Zn series lead-free solder alloy, solve the problems of easy oxidation and poor wettability of Sn-Zn series solder alloy

Method used

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  • Sn-Zn series leadless solder alloy and its preparation method
  • Sn-Zn series leadless solder alloy and its preparation method
  • Sn-Zn series leadless solder alloy and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1. Take LiCl and KCl respectively according to the mass ratio of LiCl: KCl component of 1.0: 1.3, a total of 10g, and mix them uniformly to prepare a protected molten salt;

[0032] 2. Take by weight respectively Zn is 8.0g (8%), Cu is 2.0g (2%) mixed rare earth RE is 0.05g (0.05%), all the other are Sn, gross weight 100%, quality is 100g altogether, And put them all into a graphite crucible and stir them into a uniform mixture, cover the mixture in the crucible with the prepared protective molten salt, put the crucible in a well-type vacuum furnace for melting, vacuumize and fill it with high Pure nitrogen, when the furnace temperature reaches 600°C, keep it warm for 60 minutes, after melting, take out the crucible, pre-cool and cast the alloy;

[0033] 3. Remelt the casted alloy above at 400°C, keep it warm for 50 minutes, stir, and finally cast it into an ingot.

[0034] The cast ingot is prepared as a sample, and all aspects of its performance are tested. The allo...

Embodiment 2

[0040] 1. Take LiCl and KCl respectively at a mass ratio of 1.2:1 according to the LiCl:KCl component, which is 10 g in total, and mix them uniformly to prepare a protected molten salt;

[0041] 2. Take by weight respectively, Zn is 8.8g (8.8%), Cu is 1g (1.2%), mixed rare earth RE is 0.1g (0.1), and the rest is Sn, the total weight is 100%, and the quality is 100g in total. And put them all into a graphite crucible and stir them into a uniform mixture, cover the mixture in the crucible with the prepared protective molten salt, put the crucible in a well-type vacuum furnace for melting, vacuumize and fill it with high Pure nitrogen, when the furnace temperature reaches 650°C, keep it warm for 60 minutes, after melting, take out the crucible, pre-cool and cast the alloy;

[0042] 3. Remelt the casted alloy above at 420°C, keep it warm for 40 minutes, stir, and finally cast it into an ingot.

[0043] Wetting angle

Embodiment 3

[0045] 1. LiCl and KCl were taken in a mass ratio of 0.8:1.0 according to the LiCl:KCl component, which was 10 g in total, and mixed uniformly to prepare a protected molten salt;

[0046]2. Weigh respectively according to the mass ratio, Zn is 9.0g (9%), Cu is 3g (3%), mixed rare earth RE is 0.025g (0.025%), and the rest is Sn, the total weight is 100%, and the total mass is 100g , and put them all into a graphite crucible and stir into a uniform mixture, cover the mixture in the crucible with the prepared protective molten salt, place the crucible in a well-type vacuum furnace for melting, vacuumize and fill it with High-purity nitrogen, when the furnace temperature reaches 550°C, keep it warm for 90 minutes. After melting, take out the crucible, pre-cool and cast the alloy;

[0047] 3. Remelt the casted alloy above at 350°C, keep it warm for 60 minutes, stir, and finally cast it into an ingot to obtain the product.

[0048] The cast ingot is prepared as a sample, and all as...

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Abstract

The invention relates to a Sn-Zn lead free solder alloy. It feeds Cu and RE through Sn-Zn alloy to get Sn-Zn lead free solder alloy, with composition of Zn 8-9%, Cu 1-3%, RE being 0. 025-0. 1%, with the rest being Sn. RE is the surface active element, it can improve the evenness and moisture of the solder tissue, and the Cu element can improve the elasticity of the alloy. On the basis of retaining the low fuse point of the Sn-Zn lead free alloy, it has good moisture and anti oxidization feature. It can be widely used for electronic sealing material.

Description

technical field [0001] The invention belongs to the technical field of welding materials, relates to a Sn-Zn series lead-free solder alloy, and also relates to a preparation method of the Sn-Zn series lead-free solder alloy. Background technique [0002] With the continuous development of mainstream electronic products in the direction of miniaturization and high integration, the physical properties of solder are increasingly showing its importance. Among them, the Sn-Zn series brazing material is valued for its low melting point, low cost and abundant resources, and has great development potential and market prospect. However, Sn-Zn solder has disadvantages. One is that it is easy to oxidize. During the welding process, the oxidation of the alloy produces a large amount of scum, which causes a waste of solder; sexual issues. Therefore, how to overcome the shortcomings of Sn-Zn based solder alloys and produce a lead-free solder alloy with excellent oxidation resistance and...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/02
Inventor 赵麦群赵小艳孙立恒
Owner XIAN UNIV OF TECH
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