Semiconductor package and its array arranged substrate structure and production method

Abstract

The invention discloses a semiconductor encapsulation piece and substrate structure which is arranged in array and preparation method, the semiconductor encapsulation piece includes: substrate unit part of which forms groove, and plugging compound is filled into the groove; semiconductor chip which is electric connected to the substrate unit; and encapsulation colloid which is formed on the substrate unit and covers the semiconductor chip. When incising along the substrate unit, the incision path passes through the plugging compound or encapsulation colloid, electric detection of substrate unit can be proceeded in advance, it can avoid problem that the material and working procedure are wasted and cost is increased induced by poor product when succeeding steps are accomplished, at the same time, the cutting surface is flat, lead circuit can not be exposed at the cutting surface, it can avoid problems of damage of static and inroad of damp.

Description

technical field [0001] The present invention relates to a semiconductor package and its array-arranged substrate structure and manufacturing method, in particular to an array-arranged substrate structure and manufacturing method with an electroplating bus and its semiconductor package. Background technique [0002] Due to the substantial growth of various portable (Portable) products such as communications, networks, and computers, the area of ​​integrated circuits (ICs) can be reduced, and ball grid array (BGA) packages with high density and multi-pin characteristics have become increasingly popular. Become a mainstream product in the packaging market. The feature of the ball grid array package is that a semiconductor chip is placed on a substrate, and a plurality of solder balls (Solder Ball) arranged in a grid array are arranged on the back of the substrate, so that the same unit area of ​​the semiconductor chip carrier It can accommodate more input / output connection ter...

AI Technical Summary

Problems solved by technology

[0007] For example, in the semiconductor package disclosed in U.S. Patent Publication 2004/0259291, when the package molding is completed, laser cutting is used to cut the package units arranged in an array to form an irregular Micro SD memory card package. Since the laser cutting path needs to pass through Different materials, such as encapsulation gel, solder repellent layer, conductive circuit, plating bus, etc., can easily cause burning problems on the cutting surface, resulting in irregular shapes and uneven cutting surfaces

[0008] In addition, after the cutting operation is completed, the cutting section of the above-mentioned semiconductor package will expose the conductive lines, which will easily lead to the intrusion of external moisture into the package along the exposed conductive lines, resulting in problems such as a decrease in product reliability.

Furthermore, the conductive circuit exposed by the cutting section is very easy to cause electrostatic current to invade the package due to external electrostatic discharge (ESD), causing damage to the chip.

[0009] Even, in this packaging substrate that utilizes electroplating buses to for...

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