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B stage epoxy resin solution and preparing method thereof

An epoxy resin solution, B-stage technology, applied in the field of B-stage epoxy resin solution and its preparation, can solve the problems of insufficient research on the preparation method, long reaction time, uncontrollable reaction end point, etc. The effect of reaction temperature and shortening reaction time

Inactive Publication Date: 2008-01-09
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using cycloester epoxy resin—dicyclopentadiene dioxide as raw material resin, acid anhydride as curing agent, and polyol as catalyst, B-stage epoxy resin or solution can be prepared, but the research on its preparation method is still insufficient , the preparation method reported in the literature has the problem of long reaction time and uncontrollable reaction end point

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The synthesis ratio of epoxy resin solution in stage B of the present embodiment is shown in the following table 1:

[0016] Table 1

[0017] Material

[0018] Preparation method: at normal temperature, add the solvent xylene into the reaction kettle, add dicyclopentadiene dioxide resin, maleic anhydride and trimethylolpropane under stirring, then start to heat up under reflux conditions, and control the stirring speed to 600 rev / min, the heating rate is 2°C / min, raise the temperature of the reactant to 135°C, and continue to react at this temperature for 2 hours. The mixture is rapidly cooled to below 50° C., the solvent acetone is added, and stirred evenly to obtain a B-stage resin solution with a solid content of about 60%.

Embodiment 2

[0020] The coating composition ratio of this embodiment is shown in Table 2.

[0021] Table 2

[0022] Material

[0023] Preparation method: at normal temperature, add the solvent xylene into the reaction kettle, add dicyclopentadiene dioxide resin, maleic anhydride and trimethylolpropane under stirring, then start to heat up under reflux conditions, and control the stirring speed to 500 rev / min, the heating rate is about 1.5°C / min, the temperature of the reactant is raised to 140°C, and the reaction is continued at this temperature for 1 hour. At this time, the observed sample has been separated after standing, and then The reactant is rapidly cooled to below 50° C., the solvent acetone is added, and the mixture is evenly stirred to obtain a B-stage resin solution with a solid content of about 59%.

Embodiment 3

[0025] The coating composition ratio of this embodiment is shown in Table 3.

[0026] table 3

[0027] Material

[0028] Preparation method: at normal temperature, add the solvent xylene into the reaction kettle, add dicyclopentadiene dioxide resin, maleic anhydride and trimethylolpropane under stirring, then start to heat up under reflux conditions, and control the stirring speed to 400 rev / min, the heating rate is about 2°C / min, the temperature of the reactant is raised to 120°C, and the reaction is continued at this temperature for 3 hours. The reactant is rapidly cooled to below 50° C., the solvent acetone is added, and the mixture is evenly stirred to obtain a B-stage resin solution with a solid content of about 58.5%.

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Abstract

A B-stage epoxy resin solution and its preparation are disclosed. The process is carried out by taking bicylclic pentadiene as raw material resin, taking maleic anhydride as curing agent, taking tri-hydroxymethyl propane as catalyst, taking dimethyl benzene as solvent, polymerizing and synthesizing to obtain final product. It shortens synthetic time and can be used as impregnating material, binder and self-adhesive pigment and coating.

Description

technical field [0001] The invention belongs to the technical field of chemical industry, and in particular relates to a B-stage epoxy resin solution and a preparation method thereof. Background technique [0002] B-stage epoxy resin solutions are used in many fields, such as substrate manufacturing for printed circuit boards, enameled wire manufacturing, prepregs for composite materials, etc. However, the heat resistance of ordinary epoxy resin is not high. Therefore, modifying epoxy resin or using special epoxy resin is the main way to improve the heat resistance of epoxy resin final products. Ester ring epoxy resin is a kind of special epoxy resin with relatively high heat resistance. Using cycloester epoxy resin—dicyclopentadiene dioxide as raw material resin, acid anhydride as curing agent, polyol as catalyst, B-stage epoxy resin or solution can be prepared, but the research on its preparation method is still insufficient , The preparation method reported in the liter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/22
Inventor 钟世云
Owner TONGJI UNIV
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