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Pattern forming material, pattern forming apparatus and permanent pattern forming method

A patterned, permanent technology, applied in photolithographic process exposure devices, photosensitive materials for optomechanical equipment, exposure methods of radiation-sensitive masks, etc., can solve the problems of permanent patterning methods that have not yet been provided, low sensitivity, etc.

Inactive Publication Date: 2008-01-16
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the conventional technologies related to these solder resists, the exposure dose was as high as 500 to 3000mJ / cm 2 , low sensitivity
[0007] Therefore, currently, for the purpose of forming a permanent pattern such as a solder resist, a high-sensitivity patterning material using a highly transparent substance as a support, a patterning device equipped with the patterning material, and a device using the patterning material A permanent patterning method has not yet been provided and is subject to further development

Method used

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  • Pattern forming material, pattern forming apparatus and permanent pattern forming method
  • Pattern forming material, pattern forming apparatus and permanent pattern forming method
  • Pattern forming material, pattern forming apparatus and permanent pattern forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0510] -Composition of photosensitive composition-

[0511] Based on the following composition, the photosensitive composition (solution) was prepared.

[0512] · Barium sulfate (manufactured by Sakai Chemical Industry Co., Ltd., B30) dispersion solution...50.00 parts by mass

[0513] ·PCR-1157H

[0514] (manufactured by Nippon Kayaku Co., Ltd., epoxy acrylate adhesive 61.2% by mass

[0515] Diethylene glycol monomethyl ether acetate solution)...81.70 parts by mass

[0516] ・Dipentaerythritol hexaacrylate...13.16 parts by mass

[0517] ・Trimethylolpropane EO-added triacrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd., V#360)...5 parts by mass

[0518] ・IRGACURE819 (manufactured by Ciba Special Chemicals Co., Ltd.)...7 parts by mass

[0519] ・Epoxy resin (YX4000, manufactured by Nippon Epoxy Resin Co., Ltd.)...20.00 parts by mass

[0520] ・Epoxy resin (RE306, manufactured by Nippon Kayaku Co., Ltd.)...5.00 parts by mass

[0521] ・Dicyandiamide ... 0.13 p...

Embodiment 2

[0580] -Production of pattern forming material and laminate-

[0581] In Example 1, except that the thickness of the support was 16 μm, the thickness of the photosensitive layer was 25 μm, the thickness of the protective film was 12 μm, and the total thickness was 53 μm, a pattern forming material and a laminate were produced in the same manner as in Example 1.

[0582]

[0583] About the said support body, it carried out similarly to Example 1, and measured the total light transmittance and haze value.

[0584] In addition, sensitivity, resolution, resist surface shape, and curling properties were evaluated for the laminated body in the same manner as in Example 1.

Embodiment 3

[0586] -Production of pattern forming material and laminate-

[0587] In Example 1, except that the thickness of the support was 16 μm, the thickness of the photosensitive layer was 60 μm, the thickness of the protective film (polyethylene film) was 25 μm, and the total thickness was 101 μm, patterning was produced in the same manner as in Example 1. Materials and laminates.

[0588]

[0589] About the said support body, it carried out similarly to Example 1, and measured the total light transmittance and haze value.

[0590] In addition, sensitivity, resolution, resist surface shape, and curling properties were evaluated for the laminated body in the same manner as in Example 1.

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Abstract

A pattern forming material by which a highly sensitive and highly fine pattern can be formed by using a highly transparent substance as a supporting body and specifying the total thickness so as to form a permanent pattern such as a solder resist. The pattern forming material is provided with at least a supporting body, and a photosensitive layer and a protection film on the supporting body. The photosensitive layer includes at least a binder, a polymeric compound, a photopolymerization initiator, and a thermal cross-linking agent. The total thickness of the supporting body, the photosensitive layer and the protection film is 30-200 m, and at the time of exposing and developing the photosensitive layer, a minimum light energy of 0.1-200mJ / cm2 is used in exposure wherein a thickness of a portion of the photosensitive layer to be exposed is not changed after exposure and development.

Description

technical field [0001] The present invention relates to a pattern forming material suitable for forming permanent patterns such as protective films, interlayer insulating films, solder resists, etc., a pattern forming device equipped with the pattern forming material, and a permanent pattern forming method using the pattern forming material. Background technique [0002] When forming a permanent pattern such as a wiring pattern, a pattern forming material that forms a photosensitive layer by applying and drying a photosensitive resin composition on a support is used. As a method for producing the permanent pattern, for example, on a substrate such as a copper-clad laminate on which the permanent pattern is formed, the pattern forming material is laminated to form a laminate, and the photosensitive layer in the laminate is exposed. , After the exposure, the photosensitive layer is developed to form a pattern, and then the permanent pattern is formed by performing an etching p...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/033G03F7/09G03F7/11G03F7/20
CPCG03F7/033H05K3/0023G03F7/029H05K3/28H05K3/0082G03F7/11
Inventor 高岛正伸
Owner FUJIFILM CORP
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