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Method for cutting crisp material substrate

A technology for brittle material substrates and cutting methods, applied in glass cutting devices, welding/welding/cutting items, stone processing equipment, etc., can solve problems affecting product yield and damage to glass substrates, so as to improve product yield and guarantee The effect of cut quality

Inactive Publication Date: 2008-02-13
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the above-mentioned laser cutting method will cause great damage to the glass substrate, thereby affecting the product yield

Method used

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  • Method for cutting crisp material substrate
  • Method for cutting crisp material substrate

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Embodiment Construction

[0015] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] Please refer to FIG. 1, the method for cutting a brittle material substrate provided by an embodiment of the present invention includes the following steps:

[0017] (1) A brittle material substrate 20 is provided, and the brittle material substrate 20 may be a glass substrate, a ceramic substrate, a quartz substrate, a silicon wafer (Silicon Wafer) and the like.

[0018] (2) Using the first laser beam 240 generated by the solid-state laser 210 to form a pre-cut line (Pre-crack) 23 on the surface of the brittle material substrate 20 . The specific steps are as follows:

[0019] The brittle material substrate 20 to be processed is placed on the carrier platform (not shown); the first laser beam 240 generated by the solid-state laser 210 is guided to the first focusing lens group 230 after passing through the first reflector 220, the first The focusing...

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Abstract

A method for processing a brittle substrate includes first providing a brittle substrate having a substrate surface. Then applying a first laser beam onto the brittle substrate surface to form a pre-cut groove in the brittle substrate, the first laser beam being generated by a solid-state laser device. A second laser beam is then applied onto the brittle substrate surface along the precut groove to heat the brittle substrate, the second laser beam being generated by a gas laser device. Finally, a coolant is applied onto the brittle substrate along the pre-cut groove so as to cause formation of a through crack in the brittle substrate. The first laser beam can be generated by a solid-state laser device, the first laser beam should be of narrow diameter and high energy density, so the first laser beam can form a pre-cut groove rapidly and accurately without generation of micro-cracks, in addition, the pre-cut groove should have a better uniformity and linearity.

Description

technical field [0001] The invention relates to a cutting method for a brittle material substrate, in particular to a cutting method for laser cutting a brittle material substrate. Background technique [0002] With the continuous development of technology, liquid crystal display devices (TFT-LCD) have been widely used in the consumer field due to their own characteristics. A liquid crystal display device is generally composed of two glass substrates, liquid crystal contained in the two glass substrates and a number of circuits. The liquid crystal can change the arrangement mode under the influence of the electric field to complete the display operation. In order to form liquid crystal display panels of different sizes, it is generally necessary to cut larger liquid crystal display panels to meet different requirements. [0003] In the process of cutting glass substrates by laser, most of the cutter wheels, diamond knives or gas lasers are used to generate pre-cut lines on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/42
CPCB28D5/0011B23K26/0608C03B33/093B23K26/1417B23K26/4075B23K26/408B23K26/40B23K26/146B23K2103/50B23K2103/52
Inventor 傅承祖黄俊凯陈献堂方瑞文郭访璇许宗富
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC
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