High-strength high-conduction strengthened dispersion copper alloy and preparation method thereof

A technology for dispersion strengthening of copper and copper alloys, applied in metal rolling, metal rolling, metal processing equipment, etc., can solve the problems of uniform and stable suspension of particles in the composite electrodeposition method that is difficult to control, and the size limit of composite material products, etc., to achieve Excellent anti-high temperature softening ability, shorten production cycle, high anti-softening temperature effect

Inactive Publication Date: 2008-02-13
LUOYANG INST OF SCI & TECH
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  • Application Information

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Problems solved by technology

However, these new technologies still have certain limitations in application, for example, the uniform and stable suspension of composite electrod

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  • High-strength high-conduction strengthened dispersion copper alloy and preparation method thereof

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Embodiment 1

[0029] In this embodiment, 0.14wt% Al is added to the Cu-copper alloy base material.

[0030] The process for preparing the above-mentioned copper alloy material includes:

[0031] ①Smelting of alloys ②Hot rolling or cold rolling (or wire cutting) of alloys to prepare sheets ③Internal oxidation of alloy sheets ④Lamination of internally oxidized sheets with hot pressing ⑤Alloy processing.

[0032] Among them: the melting of the alloy is carried out in an intermediate frequency induction furnace in an atmospheric environment, and the Cu-Al alloy is made of high-purity cathode copper (Cu≥99.90wt%) and electrolytic aluminum (Al≥99.90wt%) as raw materials. It is Φ80mm×150mm.

[0033] Hot rolling or cold rolling (or wire cutting) of the alloy to prepare thin plates is to remove the defects on the surface and ends of the ingot, forge it into a billet with a rectangular cross-sectional size of 15mm×100mm (forging temperature is 800°C), and then heat it at 900°C×10h Heating under the...

Embodiment 2

[0039] In this embodiment, the addition content of Cu copper alloy base material is 0.30wt%.

[0040] The process for preparing the above-mentioned copper alloy material includes:

[0041] ①Smelting of alloys ②Hot rolling or cold rolling (or wire cutting) of alloys to prepare sheets ③Internal oxidation of alloy sheets ④Lamination of internally oxidized sheets and hot extrusion ⑤Alloy processing.

[0042] Among them: alloy smelting means that the alloy is smelted in an intermediate frequency induction furnace in a traditional atmospheric environment, and the Cu-Al alloy is smelted by using high-purity cathode copper (Cu≥99.90wt%) and electrolytic aluminum (Al≥99.90wt%) as raw materials Pouring, ingot size is Φ80mm×150mm. The Al content is 0.30 wt%.

[0043] Wherein: the smelting of alloy is with embodiment 1.

[0044] The hot rolling or cold rolling (or wire cutting) of the alloy to prepare the thin plate is to remove the defects on the surface and both ends of the ingot, an...

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Abstract

The invention discloses a high strength and high conductivity dispersion strengthened copper alloy. 0.10 to 0.30wtpercent Al is added into an alloy-based material. The technology of the invention cosists of (1)Melting of alloy; (2) Hot rolling or cold rolling (wire cutting)of alloy for preparing thin sheets; (3)Internal oxidation of alloy sheet; (4)Heat pressing and hot extrusion of alloy sheet with internal oxidation; (5)Processing of alloy. Wherein, the thickness of the alloy thin sheet is 0.3 to 2.0mm; and the method for internal oxidation is embedding with the standard of (850DEG C -950DEG C) * (3-15) h; and the temperature of heat pressing and hot extrusion is 900DEG C-950DEG C. The invention adopts a Cu-Al alloy internal oxidation thin sheet, and the micro-hardness and the conductivity of the alloy with the process of heat pressing reaches 120 HV and 78percent IACS respectively; and the tensile strength reaches 260MPa. The micro-hardness and the conductivity of the alloy with the process of hot extrusion reach 135 HV and 85percent IACS respectively; and the tensile strength reaches 450MPa. The softening temperature of the alloy reaches above 900DEG C.

Description

technical field [0001] The invention belongs to the technical field of alloy materials, in particular to the preparation technology of dispersed copper for preparing resistance welding electrode materials, and mainly relates to a high-strength and high-conductivity dispersion-strengthened copper alloy and a preparation method thereof. Background technique [0002] al 2 o 3 Dispersion strengthened copper is a new type of structural functional material with excellent comprehensive physical and mechanical properties. It has broad application prospects in the fields of modern electronic technology and electrical engineering. With the development of the electronic industry, it has become one of the research hotspots of copper alloy materials. . Dispersion-strengthened copper-based composite materials are mainly used in the following aspects: (1) instead of silver-based contact materials; (2) as conductive elastic materials and IC lead frames; (3) for military high-power microwa...

Claims

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Application Information

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IPC IPC(8): C22C9/01C22C1/02B21B3/00B21B37/00
Inventor 张旦闻赵冬梅任凤章孙鹃赵秀婷张晓楠
Owner LUOYANG INST OF SCI & TECH
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