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Moisture-heat-proof epoxy adhesive

An epoxy adhesive, moisture and heat resistant technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of free volume increase, etc., and achieve the effect of excellent high temperature resistance

Inactive Publication Date: 2008-02-20
HARBIN ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the free volume of the encapsulation material also increases, leading to an increase in water absorption

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Component A: 65 parts of F-44 epoxy resin, 35 parts of bisphenol fluorene epoxy resin (epoxy value 0.40);

[0019] Component B: 35 parts of diamine fluorene.

[0020] Mix component A uniformly at 120°C in advance, add component B, and stir at 120°C for 10 minutes to make a liquid adhesive. solidify. The shear strength is tested according to the national standard. The water absorption test is to make the cured resin into a test piece with a size of 20mm×5mm×2mm, boil it in boiling water for 48 hours, and the test results are: the shear strength at room temperature is 11.54MPa, and the shear strength at 200°C 12.91MPa, water absorption rate 1.6%.

Embodiment 2

[0022] Component A: 50 parts of E-44 epoxy resin, 50 parts of bis-o-cresol fluorene epoxy resin (epoxy value 0.38)

[0023] Component B: 37 parts of diamine fluorene

[0024] Other conditions are the same as in Example 1. The results of the shear strength test are as follows: the shear strength at room temperature is 14.54 MPa, the shear strength at 200° C. is 12.34 MPa, and the water absorption rate is 1.4%.

Embodiment 3

[0026] Component A: 25 parts of TDE-85 epoxy resin, 25 parts of E-44, 50 parts of bisphenol fluorene epoxy resin (epoxy value 0.40)

[0027] Component B: 46 parts of diamine fluorene

[0028] Other conditions are the same as in Example 1. The results of the shear strength test are as follows: the shear strength at room temperature is 13.26 MPa, the shear strength at 200° C. is 11.72 MPa, and the water absorption rate is 2.1%.

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Abstract

The invention provides a heat and humidity resistance epoxy adhesive. The adhesive consists of a component A and a component B; the quality ratio of the component A is: 20 to 100 shares of fluoryl epoxy resin, 1 to 50 shares of bisphenol A epoxy resin, 1 to 100 shares of novolac epoxy resin or 1 to 50 shares of alicyclic glycidyl epoxy resin; the component B consists of 20 to 80 shares of aromatic diamine curing agents. The invention has the advantages of excellent high temperature resistance. Compared with a normal or a modified epoxide resin, the high temperature shearing strength is much higher and the water absorption rate is much lower. The invention is suitable for an occasion where strong high temperature shearing strength is required under hot and humid environment.

Description

(1) Technical field [0001] The present invention relates to an adhesive. (2) Background technology [0002] With the rapid development of high-density mounting technology in the electronic field, more and more thin packages are used. However, when this thin packaged device is mounted on a printed circuit board, the package must be dipped in a tin bath as a whole. This soldering process must withstand a high temperature of more than 200 ° C. , due to the harsh environment, the packaging material must have high heat resistance and high bonding strength. Epoxy resin has good heat resistance and dimensional stability, adhesive performance, electrical insulation performance and chemical corrosion resistance, while general-purpose epoxy resins, such as bisphenol A epoxy resin, novolac epoxy resin, multifunctional AG -80 (i.e. TGDDM) epoxy resin, cycloaliphatic glycidyl ester (such as TDE-85) and their modified resins, after being cured by a general curing agent, the resin has hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00
Inventor 王军邱琪浩田浩霍子春孙鹤刘华荣
Owner HARBIN ENG UNIV
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