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Hardening accelerator, hardenable resin composition, and electronic component device

一种固化促进剂、固化性树脂的技术，应用在固化性树脂组合物领域，能够解决难获得流动性等问题

Inactive Publication Date: 2008-02-27
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under such circumstances, even in the case of using the above-mentioned phosphorus-based curing accelerator proposed to improve the decrease in fluidity of the epoxy resin composition for encapsulation, it is increasingly difficult to obtain sufficient fluidity

Method used

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  • Hardening accelerator, hardenable resin composition, and electronic component device
  • Hardening accelerator, hardenable resin composition, and electronic component device
  • Hardening accelerator, hardenable resin composition, and electronic component device

Examples

Experimental program
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Effect test

Embodiment

[0228] Hereinafter, the present invention will be specifically described according to the embodiments, but the scope of the present invention is not limited to the embodiments shown below. Needless to say, as long as it does not depart from the gist of the present invention, it is possible to carry out various changes sex.

[0229] [Preparation of curing accelerator]

[0230]Before preparing curable resin composition, the compound used as a hardening accelerator in each Example of this invention was prepared according to synthesis examples 1-9. Furthermore, in each synthesis example, 4-triphenylphosphonium-base (phosphonio) phenoxide, 2-triphenylphosphonium-base phenoxide, 3-triphenylphosphonium-base phenoxide, 2,6-Dimethyl-4-triphenylphosphonium-base phenoxide, 3-three-p-tolylphosphonium-base phenoxide, and cyclohexyldiphenylphosphonium-base phenoxide are all made by patent-opened Synthesized by the method described in the 2004-156036 bulletin.

[0231] In addition, the an...

Synthetic example 1

[0239] 10.9 g (30.8 mmol) of 4-triphenylphosphorylphenoxide was dispersed (partially dissolved) in 100 ml of acetone, and 10.0 g (46.2 mmol) of diphenylsilanediol was added to the solution while stirring. The light yellow 4-triphenylphosphonium phenate powder in the solution will slowly turn white. Considering that diphenylsilanediol is soluble in acetone, this change may be due to the reaction of partially dissolved 4-triphenylphosphinylphenate with diphenylsilanediol and gradually being consumed , so as to precipitate out with the salt of 4-triphenylphosphonium-base phenoxide and diphenylsilanediol. After the reaction mixture was stirred at room temperature for 12 hours, it was filtered and dried to obtain 16.3 g of a white solid product.

[0240] For the obtained product, the 1 H-NMR determination, 31 As a result of P-NMR measurement (measurement in deuterium methanol) and IR measurement, the spectra shown in FIGS. 1 to 3 were respectively obtained. As a result of ident...

Synthetic example 2

[0244] 30.0 grams (84.6 mmol) of 4-triphenylphosphine-based phenoxide were dispersed (partially dissolved) in 60 ml of acetone and 30 ml of distilled water, and while stirring in the solution, 18.3 g (84.6 mmol) of diphenylsilanediol was added. ). Accompanied by the addition of diphenylsilanediol, 4-triphenylphosphine-base phenoxide will dissolve first, and immediately separate out white powder. The reaction mixture was stirred at room temperature for 30 minutes, and after distilling off about 30 ml of acetone with an evaporator, it was filtered and dried to obtain 43.5 g of a white solid product.

[0245] For the obtained product, the 1 H-NMR determination, 31 As a result of P-NMR measurement (measurement in deuterium methanol) and IR measurement, the same spectrum as in Synthesis Example 1 was obtained. Therefore, it was confirmed that the product had the structure represented by the above-mentioned formula (XX) similarly to Synthesis Example 1 (hereinafter referred to as...

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Abstract

The present invention provides a curing accelerator having excellent fluidity, reflow crack resistance, high-temperature storage characteristics, and excellent curability when absorbing moisture, a curable resin composition, and a device encapsulated with the composition. Components of electronic devices. In the present invention, a curable resin composition is prepared using a curing accelerator containing a compound represented by the following formula (I). (In the formula, R1 is each independently selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group with 1 to 18 carbon atoms, two or more R1 can be combined to form a ring structure, R2 and R3 are each independently selected from a hydrogen atom , hydroxyl, and a substituted or unsubstituted organic group with 1 to 18 carbon atoms, two or more R2 or R3 can be combined to form a ring structure, YH is a carbon atom with one or more releasable protons (H+) An organic group with a number of 0 to 18 can be combined with one or more R2 to form a ring structure, m is an integer of 1 to 4, and p is a number of 0 or more).

Description

technical field [0001] The present invention relates to a curing accelerator, a molding material containing the curing accelerator, a curable resin composition suitable as a material for laminates and adhesives, and an electronic device having components encapsulated using the curable resin composition. device device. Background technique [0002] Conventionally, curable resins such as epoxy resins have been widely used in the fields of molding materials, laminated boards, and adhesive materials. From the viewpoint of improving productivity, these curable resins are required to have rapid curing properties, so compounds that can accelerate the curing reaction, that is, curing accelerators, are generally used in curable resin compositions. For example, in the field of packaging technology for elements of electronic devices such as transistors and ICs, compositions based on epoxy resins among curable resins are widely used. The reason for this is that epoxy resins can achiev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/68H01L23/31H01L23/29
CPCC08L61/06H01L23/296C08L63/00C08G59/688C08G59/621H01L2924/0002H01L2924/00C08G59/40H01L23/29C07F9/54
Inventor 中村真也
Owner RESONAC CORP
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