Middle-temperature sharp-quenching aluminum solder and method of producing the same

An aluminum brazing filler metal and a medium temperature technology, which are applied to the medium temperature quenching aluminum brazing filler metal and its preparation, the Al-Si-Cu-Zn quenching brazing filler metal for brazing aluminum and aluminum alloys and the field of preparation, and can solve the problem of high melting point of the Al-Si brazing filler metal. , to achieve the effect of low melting temperature, good manufacturability and smooth surface

Inactive Publication Date: 2008-03-05
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Technical problem: the purpose of this invention is to solve the problem of high melting point of Al-Si brazing filler metal commonly used at present, to provide a kind of medium-temperature quenching aluminum brazing filler metal with lower melting point and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Component formulation: the components and contents of the brazing filler metal are as follows: Si: 7.5%; Cu: 20.0%; Zn: 2.5%; Sr: 0.05%; the rest is Al.

[0021] Preparation:

[0022] (1) The raw materials according to the above ratio are prepared into the master alloy of the quenched solder by the conventional aluminum alloy smelting method, which is pulverized and loaded into the quartz glass tube of the HVDS-II high-vacuum single-roller stripping machine. The quartz tube nozzle is rectangular, and its length is a=6-8mm; width b=0.5-1mm;

[0023] (2) Clamp the quartz glass tube into the induction heating ring of the stripping machine, and adjust the distance from the nozzle to the surface of the copper roller to b n =1-2mm, to ensure that the liquid sprayed on the copper roller is a flat flow and form a steady flow state;

[0024] (3) Close the furnace door, and use a mechanical pump to evacuate to 1.5×10 -1 Pa, high vacuum pumped by molecular pump to 3×10 -3 pa, ...

Embodiment 2

[0030] Component formula: the components and contents of the brazing filler metal are as follows: Si: 10.0%; Cu: 20.0%; Zn: 5.0%; Sr: 0.05%; the rest is Al.

[0031] Preparation method: same as the preparation method of Example 1.

[0032] The melting temperature range of the brazing filler metal is 508-521°C, and the brazing temperature is 540°C. With the brazing in the QJ201 flux furnace, the shear strength of the brazed pure aluminum joint is 104MPa, and the brazed 6063 aluminum alloy joint shear strength is 104MPa. The strength is 97MPa.

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Abstract

The present invention belongs to the field of aluminum and aluminum alloy connecting material, relates to aluminum brazing material, and is especially one kind of fast cooled Al-Si-Cu-Zn brazing material for brazing aluminum and aluminum alloy and its preparation process. The Al-Si-Cu-Zn brazing material consists of Si 5.0-12.5 wt%, Cu 15.0-30.0 wt%, Zn 2.5-7.5 wt%, Sr 0.001-0.5 wt% and Al for the rest. The Al-Si-Cu-Zn brazing material is prepared through one single roll and fast cooling process. It has melting temperature of 500-525 deg.c and brazing temperature of 530-570 deg.c, and is suitable for brazing aluminum and aluminum alloy with solidus temperature over 530 deg.c.

Description

Technical field: [0001] The invention relates to a medium-temperature quenching aluminum solder and a preparation method, in particular to an Al-Si-Cu-Zn quenching solder for brazing aluminum and aluminum alloys and a preparation method, and belongs to the field of connecting materials for aluminum and aluminum alloys. Background technique: [0002] Due to their excellent physical and chemical properties, good processing, surface treatment and corrosion resistance, aluminum and aluminum alloys occupy a very important position in modern industrial materials and are widely used in aerospace, construction, electrical appliances, automobiles and ships. . It is also particularly important to realize the connection of aluminum and aluminum alloys. At present, the relatively mature aluminum solder is mainly Al-Si eutectic solder, but the liquidus temperature of Al-Si solder is too high (eutectic point 577 ° C), and only pure aluminum and a few melting points can be brazed. higher...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28C22C1/03
Inventor 邹家生赵其章罗新锋
Owner JIANGSU UNIV OF SCI & TECH
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