Non-contact smart card and its production method
The technology of a non-contact smart card and manufacturing method is applied in the direction of recording carriers used in machines, instruments, computer components, etc. It can solve problems such as solder joint detachment, affecting antenna conductivity, failure, etc., to reduce chip damage rate, Improvement of product yield and improvement of bending resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0031] The present invention will be further described below in conjunction with the accompanying drawings.
[0032] A non-contact smart card of the present invention includes a polymer base layer 12 and a filling layer 14. The polymer base layer 12 is provided with an etched antenna 11 and a chip 10, and the chip hole 13 on the filling layer 14 fits the chip of the polymer base layer 12. On 10, the thickness of the filling layer 14 is greater than or equal to the thickness of the chip 10, as shown in FIGS. 1, 2 and 3.
[0033] The method of making the contactless smart card can use a commercially available flip chip machine.
[0034] First, carry out the reverse placement process. The polymer film carrying the etched antenna 11 is installed on the inverted chip machine. Coat the bonding position on the antenna with conductive glue of the opposite sex, remove the chip 10 from the wafer and fill it in the bonding position; then press and heat the chip 10 up and down to solidify the...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap