Method for cleaning etching equipment component

A technology for etching equipment and components, applied in the directions of cleaning methods, cleaning methods and utensils, chemical instruments and methods using liquids, etc., can solve problems affecting equipment, equipment service life reduction, component damage, etc. The effect of improving utilization and easy operation

Inactive Publication Date: 2008-04-02
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can reduce the corrosion damage to the metal components of the equipment, but because the cleaning fluid used is still corrosive, it will damage the components to a certain extent. On the one hand, it will still cause the service life of the equipment to decrease. The change of state affects the original environment in the equipment, resulting in process instability
In addition, the preparation of the cleaning solution needs to be tested for the pH value, the operation is relatively complicated, and it is not very convenient to implement

Method used

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  • Method for cleaning etching equipment component
  • Method for cleaning etching equipment component
  • Method for cleaning etching equipment component

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Embodiment Construction

[0022] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0023] The processing method of the present invention can be widely applied in many applications, and should not be interpreted as only applicable to the cleaning of etching equipment components, for the cleaning of other equipment components to remove attachments, the method of the present invention is also applicable . The following is a specific description of the processing method of the present invention through a preferred embodiment, certainly the present invention is not limited to this specific embodiment, and the general replacements well known to those of ordinary skill in the art are undoubtedly included in the protection of the present invention within range.

[0024] In order to clean the components in the etching equipm...

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Abstract

The invention discloses a method for cleaning an etching equipment component, which includes the following steps that: the etching equipment component to be cleaned is immerged in the acetone solution; deionized water is used for cleaning the component; the component is put into an oven for baking. The method of the invention adopts the acetone solution with no damage to the component to clean the equipment component, which prolongs the service life of the equipment, and is also favorable to stabilized production, saving the preproduction restore step before formal production, and improving the utilization rate of the equipment.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning method for etching equipment components. Background technique [0002] As the critical dimensions of devices shrink, the control of contamination on the wafer surface becomes more and more critical. If pollution sources such as particles are introduced during the production process, it may cause open circuit or disconnection of the circuit. Therefore, in semiconductor process manufacturing, how to avoid pollution in process manufacturing must be paid attention to. With the improvement of equipment automation in production, the interaction between personnel and products becomes less, and the focus of preventing particles in production has been more focused on the particles produced by production equipment. If the equipment has been working for a long time, some attachments will accumulate on the internal components, and the shedding of the attachmen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/3065H01L21/311H01L21/3213C23F4/00B08B3/08B08B3/02B08B3/12C23G1/00
Inventor 戴祺山段昧存朱立顶肖建民
Owner SEMICON MFG INT (SHANGHAI) CORP
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