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Probe

一种探针、变形部的技术，应用在探针领域，能够解决降低打线等成品率、脱离、无法测量等问题，达到轻松维护的效果

Inactive Publication Date: 2008-04-23
木本军生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In Fig. 14(a), the vertical probe 202a mounted on the front end of the cantilever beam 201 of length L is vertically opposed to the top of the bonding pad 203 of the semiconductor chip, and the other end is mounted on the supporting part 204 so as to be horizontal. Next, after the welding pad 203 is raised or the support part 204 is lowered for inspection, the front end of the vertical probe 202a will touch the top of the welding pad 203, and about the calculated position of 1 / 3L as the center, the rotation length L For the cantilever beam 201, the front end of the vertical probe 202a touches the top of the welding pad 203, and only the moving distance d0 is enlarged; as a result, the miniaturized welding pad will break away from the front end of the vertical probe 202a from the welding pad 203, and the In addition, when the pressure on the front end of the vertical probe is high, it will cut off the top of the welding pad 203 and leave scars, so it may reduce the yield rate of subsequent processes such as wiring

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0058] The embodiment of the present invention will be described below while referring to the drawings; FIG. 1 shows a schematic diagram of the structure of a probe related to an embodiment of the present invention, and FIG. 1(a)(b) shows a schematic diagram of the action of each probe; The front end maintains a vertical state until it touches the pad of a semiconductor chip or the like; Figure 2 shows a schematic diagram of the detailed operation of the zθ deformer.

[0059] 1(a), the probe is made into a connecting ring structure by a parallel spring 11, and one side 13 is regarded as a fixed end to form a z-deformation part; And connect the zθ deformation part 15 with the center of rotation 14, and one side of the zθ deformation part 15 is connected to the surface of the pad 16 to obtain electrical conduction with the pad; in this embodiment, the zθ deformation part 15 is made into a U glyph.

[0060] Figure 1(a) moves the opposite pad 16 towards the vertical direction, an...

Embodiment 2

[0070] Embodiment 2 shows that the adhesive film stacking proposed by the present inventors makes the present invention applicable to the type of probe structure; As shown in Fig. 24 of No. 274010 bulletin, or Fig. 1 of JP-A-2005-300545, etc., a copper foil plate is pasted on the ribbon-shaped (rectangular) resin adhesive film surface, and the copper foil plate is etched so that the resin A copper probe with a curved portion is formed on the adhesive film surface, and the resin adhesive film formed by the probe is laminated to form an assembly probe.

[0071] Fig. 4 shows the structure embodiment of adhesive film lamination type probe; On the resin adhesive film (for example: polyimide (polymide)) 31 on Fig. 4, adhere copper foil (for example: beryllium (beryllium) copper), and Copper foil is etched to form zθ deformed part 32, conductive part 33, signal line terminal part 34, enhanced conductivity dummy parts (dummy) 35a, 35b, 35c, 35d; moreover, conductive part 33 and enhanc...

Embodiment 3

[0076] Fig. 6 shows the schematic diagram of the structure of the probe of embodiment 3; 51 on Fig. 6 represents the probe that only consists of the θ z deformation part on Fig. 1; one end of the θ z deformation part is supported by the fixed end 53, and the probe itself does not face z to move; Fig. 6 (a) shows the state diagram when starting to contact the pad 54, and the front end of the probe 51 then contacts the pad 54; the overdrive in progress, until the state of Fig. 6 (b) is formed, when the pad 54 is pushed After the probe 51 is raised, on the front end of the probe of the θz deformation part, a rotation action will be mainly applied to the center of rotation 52, and the action shown in FIG. conductivity.

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PUM

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Abstract

A probe available for a narrow pitch pad without the need of cleaning is realized by providing a z deformed portion that is elastically deformed in a vertical direction, and a ztheta deformed portion that is serially connected to the z deformed portion to rotate while being elastically deformed at least in the vertical direction. The ztheta deformed portion has one or more rotation centers. The probe end has a curved surface in which the ztheta deformed portion rotates about the rotation centers when coming into contact with the pad and during overdrive in the inspection, the probe end comes into contact with the pad surface at one point or within a certain range, a relative displacement occurs between the pad surface and the probe end, the contaminant material is removed in the beginning of the contact, and then electrical continuity is established in the second half of the contact.

Description

technical field [0001] The present invention relates to the probe (probe; measuring point) of the detector (probe) device that is used to check the several semiconductor chip circuits that are formed on the semiconductor wafer in the manufacturing process of electronic equipment such as LSI; The circuit terminals (pads) on the semiconductor chip are directly in contact with the probes vertically in the wafer state, so as to be used for probing tests (probing test) to measure the conductivity of the semiconductor chip as a whole. Background technique [0002] With the advancement of semiconductor technology, the integration of electronic equipment has increased, and the area occupied by circuit wiring has also increased on each semiconductor chip formed on the semiconductor wafer, so the number of circuit terminals on each semiconductor chip has also increased. (pad) number, and by reducing the area of ​​the pad and the narrow pitch of the pad, the pad arrangement is miniatur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067
CPCG01R1/06716G01R1/06733G01R1/06727G01R1/067
Inventor 木本军生
Owner 木本军生