Probe card having cantilever probes, producing method and detecting probe needlepoint locating methods

A production method and cantilever technology, which is applied in the direction of instruments, measuring devices, electronic circuit testing, etc., can solve the problems of speed crosstalk limitation, achieve the effect of precise area control, reduce crosstalk, and improve test speed and accuracy

Inactive Publication Date: 2008-05-14
CORAD TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the speed of existing probe cards in the automatic testing machine for integrated circuit testing is often limited by the crosstalk between the two test channels

Method used

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  • Probe card having cantilever probes, producing method and detecting probe needlepoint locating methods
  • Probe card having cantilever probes, producing method and detecting probe needlepoint locating methods
  • Probe card having cantilever probes, producing method and detecting probe needlepoint locating methods

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Embodiment Construction

[0047]As shown in Figures 1-10, the cantilever probe wafer probe card of the present invention is used for testing integrated circuits, and the probe card 100 of the present invention has two technical solutions belonging to a general inventive concept, The probe card 100 in one of the technical solutions includes a circuit board 105, a probe ring 110 connected to the circuit board 105, and a plurality of probes 115 connected to the probe ring 110 and the circuit board 105, which are sleeved on the circuit board 105. Several bushings 120 on at least a part of each probe 115 are used to reduce the crosstalk between the probes 115 and control the characteristic impedance of the probes 115, wherein the two ends of each probe 115 protrude from the bushing respectively 120 , each bushing 120 includes an inner dielectric portion 140 and an outer conductive portion 145 , and the conductive portion 145 of each bushing 120 is electrically connected to the circuit board 105 . From Fig. ...

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PUM

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Abstract

The invention relates to a probe card for a cantilevered probe wafer. The invention includes a circuit board, a probe ring connected with the circuit board, a plurality of probes connected with the circuit board and the probe card, and a sleeve sleeved on each probe. The sleeve comprises an inner dielectric portion and an outer conductive portion. The conductive portion of each sleeve is connected with the circuit board. As each probe is sleeved with a sleeve consisting of an inner dielectric portion and an outer conductive portion; and the conductive portion of each sleeve is connected with the relative voltage, the invention can effectively reduce the interference between probes and control the natural impedance of probes when used for detecting an integrated circuit. The invention also relates to a production method for the probe card and a method for positioning a plurality of probes.

Description

technical field [0001] The invention relates to a testing tool for testing an integrated circuit, in particular to a cantilever probe wafer probe card which can be used to test whether the integrated circuit operates normally, its production method and a method for positioning multiple probe needle points. Background technique [0002] An integrated circuit (IC) generally needs to be tested before it is applied, such as being used on a circuit board. The test of the integrated circuit is performed before wafer packaging, after packaging, and after soldering on the circuit board. To test the integrated circuit on the wafer, the probe card is generally used to contact the pad on the integrated circuit (IC). The input terminal of the probe card receives the electrical signal output by the integrated circuit, and the electrical signal output by the integrated circuit is a response to the input signal. , The electrical signal input to the probe card and integrated circuit is gene...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073G01R3/00G01R31/28
CPCG01R1/06772G01R1/07342
Inventor 徐家梧杨丹尼尔利安李立史高普高夫
Owner CORAD TECH INC
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