Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board

A photosensitive resin and photoresist technology, which is used in the manufacture of printed circuits, printed circuits, and the removal of conductive materials by chemical/electrolytic methods. Achieve good product qualification rate, reduce replacement frequency, and reduce manufacturing costs

Inactive Publication Date: 2008-05-21
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the method of using this alkaline developing type developing solution, the components of the photosensitive resin composition dissolved or dispersed in the developing solution are easily precipitated to form solid sludge (hereinafter referred to as "developing sludge"). ") or oily matter (hereinafter referred to as "scum"), if the imaging scum or scum adheres to the substrate again, short circuits and other defects will occur in the circuit formed in the subsequent process
In particular, when an antifoaming agent is used to suppress foaming during development, it becomes a condition that easily generates development residue or scum

Method used

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  • Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board
  • Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board
  • Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3 and comparative example 1～4

[0143] Binder polymers 1 to 3 as (A) component, photopolymerizable compounds 1 to 5 as (B) component, photopolymerization initiator as (C) component, additives, and solvents were listed in Table 1. Mixed as shown, the solution of the photosensitive resin composition of Examples 1-3 and Comparative Examples 1-4 was obtained. And the preparation of a solution mixes (B) component after mixing components other than (B) component first. The compounding quantity in Table 1 is shown by mass parts. In addition, (A) component shows the compounding quantity of a solid content.

[0144] Table 1

[0145] Material

[0146]

[0147] Using the solution of the photosensitive resin composition of Examples 1-3 and Comparative Examples 1-4, the photosensitive element was produced according to the following process procedure. First, on a polyethylene terephthalate film with a width of 380mm and a thickness of 16μm (manufactured by Teijin Corporation, trade name "G2-16" (hereinafte...

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Abstract

The photosensitive resin composition of the present invention is a photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound with at least one polymerizable ethylenic unsaturated group in the molecule; and (C) a photopolymerization initiator, wherein component (A) contains a polymer that contains a compound represented by the following general formula (I) as a polymerization component: CH2═C(L1)-COOL2  (I) (wherein L1 represents a hydrogen atom or methyl group and L2 represents a C2-20 alkyl group group) and component (B) contains a compound represented by the following general formula (II): (wherein R1 represents a hydrogen atom or methyl group, R2 represents a C3-20 alkyl group that has at least 2 tertiary or higher carbon atoms, X represents a C2-6 alkylene group, and n is an integer from 1 to 20).

Description

technical field [0001] The invention relates to a photosensitive resin composition, a photosensitive element using the composition, a method for forming a photoresist pattern, and a method for manufacturing a printed circuit board. Background technique [0002] Conventionally, in the field of manufacturing printed circuit boards, as a resist (resist) material used for etching or plating, etc., a three-layer structure consisting of a support, a photosensitive layer composed of a photosensitive resin composition, and a protective film has been widely used. Photosensitive element. When using such a photosensitive element as a resist material, first, the protective film on the photosensitive element is peeled off, and then, the photosensitive layer is brought into contact with a base material (copper substrate, etc.) and pressure-bonded. Then, the photographic tool for forming the pattern is attached to the support film, exposed, and after the support film is peeled off, the de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/033H05K3/06H05K3/18C08F2/44C08F2/50G03F7/004
CPCG03F7/033G03F7/027G03F7/028
Inventor 味冈芳树市川立也松田光夫稻继崇宏
Owner RESONAC CORPORATION
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