Polishing composition
A technology of polishing composition and persulfate, applied in the field of polishing composition, can solve problems such as damage to the surface flatness of semiconductor devices and difficulty in forming multilayer wiring
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Embodiment 1-31 and comparative example 1-11
[0192] Various components shown in Table 1 were mixed with water to prepare polishing compositions of Examples 1-31 and Comparative Examples 1-11.
[0193] Table 1 shows the measurement results of the pH values of the polishing compositions of Examples 1 to 31 and Comparative Examples 1 to 11.
[0194] When polishing a copper blanket wafer (copper blanket wafer) according to polishing condition 1 using each polishing composition of Examples 1-31 and Comparative Examples 1-11, the thickness of the copper blanket wafer before and after polishing was measured. The thickness of the sheet was measured using a sheet resistance machine "VR-120" manufactured by Kokusai Electric System Services Co., Ltd. From the measured thicknesses of the wafers before and after polishing, the thickness reduction amount of the wafers after polishing was calculated. The polishing speed was obtained by dividing the obtained thickness reduction by the polishing time, and the polishing speed was expre...
Embodiment 101～133 and comparative example 101～116
[0255] Each component shown in Table 2 was mixed with water to prepare each polishing composition of Examples 101-133 and Comparative Examples 101-116.
[0256] The pH values of the polishing compositions of Examples 101 to 133 and Comparative Examples 101 to 116 were measured, and the results are shown in Table 2.
[0257] When the copper-clad sheet was polished using the polishing compositions of Examples 101-133 and Comparative Examples 101-116 according to polishing condition 1, the thickness of the copper-clad sheet before and after polishing was measured. The thickness of the sheet was measured with a sheet resistance machine "VR-120" manufactured by Kokusai Electric System Services Co., Ltd. The decrease in the thickness of the polished sheet was found from the measured thickness of the sheet before and after polishing. The polishing speed obtained by dividing the obtained thickness reduction amount by the polishing time is shown in the "polishing speed column" in Ta...
Embodiment 201～235
[0300] (Examples 201-235, Comparative Examples 201-214)
[0301] Each component shown in Table 3 was mixed with water to prepare polishing compositions of Examples 201 to 235 and Comparative Examples 201 to 214. The amount of the pH adjuster to be added to each polishing composition may be such that the pH of the polishing composition becomes the value shown in Table 3. In the polishing composition of Example 214, a mixture of potassium hydroxide and 0.03% by mass of ammonia water was added as a pH adjuster. In the polishing composition of Example 215, a mixture of potassium hydroxide and 0.5% by mass of ammonium carbonate was added as a pH adjuster.
[0302] When the copper-clad sheet was polished using the polishing compositions of Examples 201-235 and Comparative Examples 201-214 according to polishing condition 1, the thickness of the copper-clad sheet before and after polishing was measured. The thickness of the sheet was measured with a sheet resistance machine "VR-120...
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