Single-chip tri-axis acceleration sensor

A shaft acceleration and temperature sensor technology, which is used in the measurement of acceleration, multi-dimensional acceleration measurement, speed/acceleration/impact measurement, etc. problems, to achieve the optimization of structural parameters and working medium, low cost, and improved device performance

Active Publication Date: 2008-05-28
MEMSIC SEMICON WUXI
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AI Technical Summary

Problems solved by technology

The shortcomings of the acceleration sensor are: 1) large structure size and low response frequency; 2) poor sensitivity; 3) output signal nonlinearity
This is a MEMS acceleration sensor product unique to MEMSIC that integrates the sensor and signal

Method used

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  • Single-chip tri-axis acceleration sensor
  • Single-chip tri-axis acceleration sensor
  • Single-chip tri-axis acceleration sensor

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Embodiment Construction

[0038] In the actual measurement, the range of temperature change is different at different positions on the line from the edge to the center. We can place multiple sets of temperature sensors at different positions on this line, and then synthesize these sensor signals through addition, subtraction, multiplication and division, so as to obtain Acceleration signals in the best x-axis direction, y-axis direction and z-axis direction.

[0039] The schematic diagram of this embodiment 1 is shown in Figure 3, with four sets of heating wires and temperature sensor groups between the center and four sides replacing the central heating wire and temperature sensors in four directions of the original biaxial acceleration sensor. The airflow under different accelerations is shown in Figure 6 and Figure 7.

[0040] A total of 4 heat sources, 8 temperature sensors. Acceleration in three directions of X-axis, Y-axis and Z-axis can be measured through this structure.

[0041] X-axis direc...

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Abstract

The invention belongs to the technical field of the sensors and relates to a thermal convecting one-chip three-axial accelerating sensor. Basic principles of the invention are that air inside a sealed cavity body is inducted to do thermal convection through a heat-sensitive component, and an accelerating signal is transmitted through calculations. The invention comprises a packing cavity which is located on the surface of a heating wire temperature sensor and an etching cavity which is located under the surface of the heating wire temperature sensor. The packing cavity and the etching cavity are arranged in symmetry in four groups of sensors around center. The invention applies for a plurality of fields as automobile, game industry, aviation, ship navigation system, product for civilian use, military, and the like. The invention adopts thermal convection principles to test accelerating information, and has no mass block, and can work under high-g. The invention has impact resistance without adhesions or granules, low cost, low failure rate, high rate of good product, high sensibility, and strong anti-interference. Compared with original one-chip three-axial accelerating sensors of MEMSIC Company, a test for accelerating inside a three-dimensional space is available.

Description

technical field [0001] The invention relates to a thermal convection single-chip three-axis acceleration sensor used in the fields of automobiles, airplanes, consumer electronics, game machines, robots, communication electronics, and safety systems. Background technique [0002] Acceleration sensors have broad application prospects in the fields of transportation, civilian products, industrial control, robotics and military. The current application of the acceleration sensor is generally characterized by the need to test the mass block. The existence of the mass block will make the sensor weak in shock resistance, narrow in the measurement range, low in reliability, difficult to reduce the size, and difficult to reduce the cost. In addition, there are problems of one kind or another in the detection of mass block motion. For example, piezoelectric or piezoresistive accelerometers are more affected by temperature, while capacitive accelerometers are more affected by initial p...

Claims

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Application Information

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IPC IPC(8): G01P15/00G01P15/18G01F1/684G01P15/08
Inventor 蒋乐跃华亚平蔡永耀
Owner MEMSIC SEMICON WUXI
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