Single-chip tri-axis acceleration sensor

Abstract

The invention belongs to the technical field of the sensors and relates to a thermal convecting one-chip three-axial accelerating sensor. Basic principles of the invention are that air inside a sealed cavity body is inducted to do thermal convection through a heat-sensitive component, and an accelerating signal is transmitted through calculations. The invention comprises a packing cavity which is located on the surface of a heating wire temperature sensor and an etching cavity which is located under the surface of the heating wire temperature sensor. The packing cavity and the etching cavity are arranged in symmetry in four groups of sensors around center. The invention applies for a plurality of fields as automobile, game industry, aviation, ship navigation system, product for civilian use, military, and the like. The invention adopts thermal convection principles to test accelerating information, and has no mass block, and can work under high-g. The invention has impact resistance without adhesions or granules, low cost, low failure rate, high rate of good product, high sensibility, and strong anti-interference. Compared with original one-chip three-axial accelerating sensors of MEMSIC Company, a test for accelerating inside a three-dimensional space is available.

Description

technical field [0001] The invention relates to a thermal convection single-chip three-axis acceleration sensor used in the fields of automobiles, airplanes, consumer electronics, game machines, robots, communication electronics, and safety systems. Background technique [0002] Acceleration sensors have broad application prospects in the fields of transportation, civilian products, industrial control, robotics and military. The current application of the acceleration sensor is generally characterized by the need to test the mass block. The existence of the mass block will make the sensor weak in shock resistance, narrow in the measurement range, low in reliability, difficult to reduce the size, and difficult to reduce the cost. In addition, there are problems of one kind or another in the detection of mass block motion. For example, piezoelectric or piezoresistive accelerometers are more affected by temperature, while capacitive accelerometers are more affected by initial p...

AI Technical Summary

Problems solved by technology

The shortcomings of the acceleration sensor are: 1) large structure size and low response frequency; 2) poor sensitivity; 3) output signal nonlinearity

This is a MEMS acceleration sensor product unique to MEMSIC that integrates the sensor and signal processing circuit on the same CMOS chip. It has the advantages of easy manufacturing, high reliability and low cost, but it cannot measure the acceleration in the Z-axis direction. Many properties cannot be fully utilized in three-dimensional space

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