Focusing and leveling measuring system and its measuring method

A measurement system, focusing and leveling technology, applied in the field of focusing and leveling measurement system, can solve the problems of low measurement accuracy, poor system stability, complicated structure of focusing and leveling measurement system, and achieve high measurement accuracy and low cost Low, the effect of improving system stability

Inactive Publication Date: 2008-05-28
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

[0005] In addition, due to its own flaws in principle, the photoelectric detection method based on slit and four-quadrant detectors (US Patent US 6765647B1) not only has poor system stability, but also has low measurement accuracy
If the photoelectric detection method based on slits and four-quadrant detectors (US Patent US 6765647B1) achieves the same accuracy as other focusing and leveling measurement systems, the structure of the focusing and leveling measurement system will become quite complicated

Method used

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  • Focusing and leveling measuring system and its measuring method
  • Focusing and leveling measuring system and its measuring method
  • Focusing and leveling measuring system and its measuring method

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Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0019] FIG. 1 shows a photolithography machine system 10 . The XYZ coordinate system of FIG. 1 is set as a right-handed rectangular coordinate system as shown in the figure, wherein the Z axis is along the optical axis of the projection objective lens of the lithography machine. The lithography machine system 10 can transfer the pattern on the mask plate 1 to the object 4 to be processed (such as a silicon wafer, etc.) in a certain proportion through the projection objective lens 3 . Wherein, the numeral 2 represents the optical axis of the projection objective lens 3 . In the lithography machine system 10 shown in FIG. 1 , it is necessary to keep the corresponding surface of the processing object 4 (such as a silicon wafer) within the focal depth range of the projection objective lens 3 . For this reason, the lithography machine adopts a fo...

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Abstract

The invention discloses a focusing leveling measuring system and a measuring method thereof. The measuring system comprises an object grating, a first image-forming system, a second image-forming system, a detecting grating, and a detecting die block, wherein the first image-forming system can lead the object grating to image on a tested object to form a first grating image through laser illuminating, and the second image-forming system can lead the first grating image to image on the detecting grating to form a first detecting image, and the first detecting image and the detecting grating are overlapped to form a first Moire fringe which is detected by the detecting die block, position information of the detecting die block is fixed, and position information of the tested object is expressed on the first Moire fringe relative to the position information of the detecting die block.

Description

technical field [0001] The invention relates to an optical electromechanical device, in particular to a focusing and leveling measuring system and a measuring method thereof in a projection photolithography system. Background technique [0002] Photolithography device (lithography machine) is one of the important equipment for the production of large-scale integrated circuits. The photolithography machine can transfer the pattern on the mask plate to the object to be processed (such as silicon wafer, etc.) in a certain proportion through the exposure device. Silicon wafers here generally refer to all exposed objects, including substrates, coatings and photoresists. During the exposure process, it is necessary to keep the corresponding surface of the processing object (such as a silicon wafer) within the focal depth range of the exposure device. For this reason, the lithography machine adopts a focusing and leveling measurement system for measuring surface position informat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00
Inventor 关俊
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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