Special-purpose material for automobile bumper and reclaiming utilizing method for waste printed circuit card
A technology for automobile bumpers and printed circuit boards, which is applied in bumpers and other directions to achieve the effects of reducing material costs, improving the degree of recycling and excellent performance
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[0026] The preparation method of special material of the present invention comprises the steps:
[0027] A. The non-metallic powder of the printed circuit board is crushed into a powder with a particle size of less than 400 mesh, the powder is dehumidified, a coupling agent is added, mixed, and the mixture is set aside;
[0028] B. Mix the mixture obtained in step A with polypropylene, rubber elastomer, linear low-density polyethylene, and bismaleimide, melt, extrude and granulate to obtain final product.
[0029] If conventional additives such as antioxidants and light stabilizers are added, these additives are mixed with polypropylene, rubber elastomer, linear low-density polyethylene, and bismaleimide in step B, and then melt-extruded and granulated together Instantly.
[0030] The special material of the invention is prepared by using the above-mentioned raw materials and preparation method, so that the glass fiber and epoxy resin in the non-metallic powder of the printed...
Embodiment 1
[0032] Raw material ratio: 2.2kg of copolymerized polypropylene, 0.4kg of POE (POE8003 of DuPont Dow Chemical Company in the United States), 0.6kg of non-metallic powder for printed circuit board (400 mesh), 1.8kg of linear low-density polyethylene (LLDPE), commercially available KH792 coupling agent 0.01kg, bismaleimide 0.01kg.
[0033] Preparation method of composite material:
[0034] A. The non-metallic powder of the printed circuit board is crushed into a powder with a particle size of less than 400 mesh, the powder is dehumidified, a coupling agent is added, mixed, and the mixture is set aside;
[0035] B. Mix the mixture obtained in step A with polypropylene, polyolefin elastomer, linear low-density polyethylene and bismaleimide, melt, extrude and granulate to obtain the product.
[0036] The temperature of each section of the extruder (SLF-35B twin-screw extruder) is as follows:
[0037] Table 1: Molding temperature of each section of twin-screw extruder
[0038] ...
Embodiment 2
[0040] Raw material ratio: PP2.7kg, POE (POE8003 from DuPont Dow Chemical Company, USA) 0.54kg, printed circuit board non-metallic powder (500 mesh) 0.36kg, linear low density polyethylene (LLDPE) 1.98kg, city Sell KH792 coupling agent 0.01kg bismaleimide 0.01kg. The preparation method is the same as in Example 1.
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